Bismuth Oxide-based Matrix Nanosystems for X-ray Contrast Diagnostics and Protection from Ionizing Radiation von Fedosenko, V. S., Iji, M. M., Lozovenko, A. A., Gorokh, G. G.

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Kenaf-fiber-reinforced poly(lactic acid) used for electronic products von Serizawa, Shin, Inoue, Kazuhiko, Iji, Masatoshi

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Self-extinguishing epoxy molding compound with no flame-retarding additives for electronic components von Iji, Masatoshi, Kiuchi, Yukihiro

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Silicone derivatives as new flame retardants for aromatic thermoplastics used in electronic devices von Iji, Masatoshi, Serizawa, Shin

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Recycling of Printed Wiring Boards with Mounted Electronic Components von Iji, M., Yokoyama, S.

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Flame-retardant epoxy resin compounds containing novolac derivatives with aromatic compounds von Iji, Masatoshi, Kiuchi, Yukihiro

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Recycling of epoxy resin compounds for moulding electronic components von IJI, M

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Environmentally conscious IC molding compound without toxic flame-retardants von Kiuchi, Y., Iji, M.

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Flame resistant glass-epoxy printed wiring boards with no halogen or phosphorus compounds von IJI, Masatoshi, KIUCHI, Yukihiro

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Flame retardancy and heat resistance of phenol-biphenylene-type epoxy resin compound modified with benzoguanamine von Iji, Masatoshi, Kiuchi, Yukihiro, Soyama, Makoto

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Decomposition of Trichlorobenzene with Different Radicals Generated by Alternating Current Electrolysis in Aqueous Solution von Nakamura, Akinobu, Hirano, Keiji, Iji, Masatoshi

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Recycling of printed wiring boards with mounted electronic parts von Yokoyama, S., Iji, M.

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Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts von Kiuchi, Y., Iji, M.

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Pyrolysis-Based Material Recovery from Molding Resin for Electronic Parts von Iji, Masatoshi, Ikuta, Yuji

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Rewritable Shape-Memory Polylactic Acid Fabricated by Thermo-Reversible Cross-Linking Based on the Diels-Alder Reaction von INOUE, Kazuhiko, YAMASHIRO, Midori, IJI, Masatoshi

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Recycling of thermosetting plastic waste from electronic component production processes von Yokoyama, S., Iji, M.

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Recycling system for printed wiring boards with mounted parts von Yokoyama, S., Ikuta, Y., Iji, M.

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New environmentally conscious flame-retarding plastics for electronics products von Iji, M., Serizawa, S., Kiuchi, Y.

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A pyrolysis-based technology for recovering useful materials from IC package molding resin waste von Ikuta, Y., Iji, M., Ayukawa, D., Shibano, S.

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Relating the hygroscopic properties of submicron aerosol to both gas- and particle-phase chemical composition in a boreal forest environment von Hong, J, Kim, J, Nieminen, T, Duplissy, J, Ehn, M, Äijälä, M, Hao, L. Q, Nie, W, Sarnela, N, Prisle, N. L, Kulmala, M, Virtanen, A, Petäjä, T, Kerminen, V.-M

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