Picturing the cosmos: a visual history of early Soviet space endeavor von Kohonen, Iina, Hyytiäinen, Tiina, Butters, Albion M

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116 Factor V Mutation Enhances Thrombin Formation in Healthy Newborn Infants von Hyytiäinen, S, Ulander, V M, Wartiovaara-Kautto, U, Kaaja, R, Heikinheimo, M, Petäjä, J

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Fresh frozen plasma reduces thrombin formation in newborn infants von Hyytiäinen, S., Syrjälä, M., Fellman, V., Heikinheimo, M., Petäjä, J.

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Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications von Chan, Y.C., Hung, K.C., Tang, C.W., Wu, C.M.L.

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A novel IMB technology for integrating active and passive components von Tuominen, R., Kivilahti, J.K.

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Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste von Ferrando, F., Zeberli, J.-F., Clot, P., Chenuz, J.-M.

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Analyses of flip chip attach reliability von Dudek, R., Schubert, A., Michel, B.

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Recent advances in electrically conductive adhesives for electronics applications von Wong, C.P., Daoqiang Lu

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ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges von Liu, J.

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Anisotropic conductive adhesive films for flip chip on flex packages von Li Li, Treliant Fang

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Laser processing of adhesives and polymeric materials for microelectronics packaging applications von Illyefalvi-Vitez, Z.

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Investigations of plasma cleaning on the reliability of electrically conductive adhesives von Morris, J.E., Probsthain, S.

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Modelling of ICA creep properties von Rusanen, O.

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Applying polymer process studies using molecular modeling von Iwamoto, N.E.

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Characterization and performance of electrically conductive adhesives for microwave applications von Felba, J., Friedel, K.P., Moscicki, A.

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Assembly of ultra thin and flexible ICs von Adler, C., Klink, G., Feil, M., Ansorge, F., Reichl, H.

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Performance of the stud bump bonding (SBB) process in comparison to solder flip chip technology von Reinert, W., Harder, T.

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Advanced substrates for wireless terminals von Savolainen, P.J.

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Modeling stresses in ultra-thin flip chips von Marjamaki, P., Reinikainen, T., Kivilahti, J.

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Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin von Lebbai, M., Kim, J.K., Yuen, M.M.F., Tong, P.

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