Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process von Kim, Hojoong, Hong, Seokjun, Shin, Cheolmin, Jin, Yinhua, Lim, Dong Hyun, Kim, Jun-yong, Hwang, Hasub, Kim, Taesung

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Barrier Metal Slurry for Low Defect Copper Damascene Chemical Mechanical Polishing von Kim, Hojoong, Seo, Kyewon, Moon, Jinok, Kim, Hyunsoo, Hwang, Hasub

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Investigation of Copper Oxide Ring Formation during Post Chemical Mechanical Polishing Cleaning of Cu Interconnect von Kim, Hojoong, Hong, Seokjun, Jin, Yinhua, Lim, Dong Hyun, Kim, Jun-yong, Hwang, Hasub, Kim, Taesung

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Investigation on Pad Surface Conditioner to Control Dishing Amount in Cu Damascene Process von Kim, Jongwon, Kim, Hojoong, Hong, Seokji, Hwang, Hasub

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Micro Unetched Oxide Defect during Buffered Oxide Etchant Process von Lim, SeungTaek, Ahn, Dukmin, Kim, Kihyun, Jung, Heechan, Lee, Byoungsu, Lee, Huihwan, Hwang, Hasub

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The Effect of Centrifugation Method for the Large Particle Removal from CMP Slurry von Yoo, Jinsu, Lee, Dongjun, Yoon, Hyunjoo, Jeon, Joonbae, Kim, Kyoungwoo, Hwang, Hasub

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A Study on Profile Control at Wafer Edge By CMP Head Separated Retainer Ring von Yoo, Jinsu, Lee, Dongjun, Yoon, Hyunjoo, Jeon, Joonbae, Kim, Kyoungwoo, Hwang, Hasub

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Barrier Metal Slurry for Low Defect Copper Damascene Chemical Mechanical Polishing von Kim, Hojoong, Seo, Kyewon, Moon, Jinok, Kim, Hyunsoo, Hwang, Hasub

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A Ring Type Residue Formation in Post Cu CMP Cleaning von Kim, Hojoong, Liim, Dong Hyun, Moon, Jinok, Kim, Jun-Yong, Hwang, Hasub, Kim, Taesung

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Micro Unetched Oxide Defect During Buffered Oxide Etchant Process von LIM, SeungTaek, Ahn, Dukmin, Kim, Kihyun, Jung, Heechan, Lee, Byoungsu, Lee, Huihwan, Hwang, Hasub

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Evaluation of An Effective Wet Cleaning Method for Particle Removal on Various Thin Films von Cho, Yoon-Sik, Lee, Hun-Hee, Yun, Min-Sang, Hwang, Hasub, Kim, Min-Su, Kang, Bong-Kyun, Busnaina, Ahmed A., Park, Jin-Goo

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