The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate von Mayappan, Ramani, Ismail, Ahmad Badri, Ahmad, Zainal Arifin, Ariga, Tadashi, Hussain, Luay Bakir

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Effect of sample perimeter and temperature on Sn–Zn based lead-free solders von Mayappan, Ramani, Ismail, Ahmad Badri, Ahmad, Zainal Arifin, Ariga, Tadashi, Hussain, Luay Bakir

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Metal Filled High Density Polyethylene Composites – Electrical and Tensile Properties von Nurazreena, Hussain, Luay Bakir, Ismail, H., Mariatti, M.

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Alumina–mild steel friction welded at lower rotational speed von Noh, Mohamad Zaky, Hussain, Luay Bakir, Ahmad, Zainal Arifin

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SPOT WELDING COPPER–1%Cr ELECTRODE TIPS PRODUCED VIA EQUAL CHANNEL ANGULAR PRESSING von Hussain, Luay Bakir, Aljubori, Ali Abadi, M Gebril, Mohamad, Sharif, NUrulakmal Mohammed

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SPOT WELDING COPPER–1%Cr ELECTRODE TIPS PRODUCED VIA EQUAL CHANNEL ANGULAR PRESSING von Luay Bakir Hussain, Ali Abadi Aljubori, Mohamad M Gebril, NUrulakmal Mohammed Sharif

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Effects of Sb on SnAgCu lead-free solder von Kuan Yew Cheong, Mei Chan Ng, Ismail, Ahmad Badri, Hussain, Luay Bakir

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