Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits von Krishnamoorthy, A.V., Chirovsky, L.M.F., Hobson, W.S., Leibengath, R.E., Hui, S.P., Zydzik, G.J., Goossen, K.W., Wynn, J.D., Tseng, B.J., Lopata, J., Walker, J.A., Cunningham, J.E., D'Asaro, L.A.

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GaAs MQW modulators integrated with silicon CMOS von Goossen, K.W., Walker, J.A., D'Asaro, L.A., Hui, S.P., Tseng, B., Leibenguth, R., Kossives, D., Bacon, D.D., Dahringer, D., Chirovsky, L.M.F., Lentine, A.L., Miller, D.A.B.

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16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit von Krishnamoorthy, A.V, Goossen, K.W, Chirovsky, L.M.F, Rozier, R.G, Chandramani, P, Hui, S.P, Lopata, J, Walker, J.A, D'Asaro, L.A

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16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit von Krishnamoorthy, A.V., Goossen, K.W., Chirovsky, L.M.F., Rozier, R.G., Chandramani, P., Hui, S.P., Lopata, J., Walker, J.A., D'Asaro, L.A.

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Simple chemical synthesis of TAG monohydroperoxides von Hui, S.P, Murai, T, Yoshimura, T, Chiba,H, Kurosawa, T

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Combined phacoemulsification and nonpenetrating deep sclerectomy in the treatment of chronic angle-closure glaucoma with cataract von Yuen, N S Y, Chan, O C C, Hui, S P, Ching, R H Y

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3-D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit von Krishnamoorthy, A.V., Lentine, A.L., Goossen, K.W., Walker, J.A., Woodward, T.K., Ford, J.E., Aplin, G.F., D'Asaro, L.A., Hui, S.P., Tseng, B., Leibenguth, R., Kossives, D., Dahringer, D., Chirovsky, M.F., Miller, D.A.B.

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Implant-apertured and index-guided vertical-cavity surface-emitting lasers (I2-VCSELs) von Chirovsky, L.M.F., Hobson, W.S., Leibenguth, R.E., Hui, S.P., Lopata, J., Zydzik, G.J., Giaretta, G., Goossen, K.W., Wynn, J.D., Krishnmaoorthy, A.V., Tseng, B.J., Vandenberg, J.M., D'Asaro, L.A.

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1-Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 μm silicon CMOS von Woodward, T.K., Krishnamoorthy, A.V., Lentine, A.L., Goossen, K.W., Walker, J.A., Cunningham, J.E., Jan, W.Y., D'Asaro, L.A., Chirovsky, L.M.F., Hui, S.P., Tseng, B., Kossives, D., Dahringer, D., Leibenguth, R.E.

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High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS von Lentine, A.L., Goossen, K.W., Walker, J.A., Chirovsky, L.M.F., D'Asaro, L.A., Hui, S.P., Tseng, B.J., Leibenguth, R.E., Cunningham, J.E., Jan, W.Y., Kuo, J.-M., Dahringer, D.W., Kossives, D.P., Bacon, D.D., Livescu, G., Morrison, R.L., Novotny, R.A., Buchholz, D.B.

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Clocked-sense-amplifier-based smart-pixel optical receivers von Woodward, T.K., Krishnamoorthy, A.V., Goossen, K.W., Walker, J.A., Cunningham, J.E., Jan, W.Y., Chirovsky, L.M.F., Hui, S.P., Tseng, B., Kossives, D., Dahringer, D., Bacon, D., Leibenguth, R.E.

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Arrays of optoelectronic switching nodes comprised of flip-chip-bonded MQW modulators and detectors on silicon CMOS circuitry von Lentine, A.L., Goossen, K.W., Walker, J.A., Chirovsky, L.M.F., D'Asaro, L.A., Hui, S.P., Tseng, B.T., Leibenguth, R.E., Kossives, D.P., Dahringer, D.W., Bacon, D.D., Woodward, T.K., Miller, D.A.B.

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A hybrid-SEED smart pixel array for a four-stage intelligent optical backplane demonstrator von Rolston, D.R., Plant, D.V., Szymanski, T.H., Hinton, H.S., Hsiao, W.S., Ayliffe, M.H., Kabal, D., Venditti, M.B., Desai, P., Krishnamoorthy, A.V., Goossen, K.W., Walker, J.A., Tseng, B., Hui, S.P., Cunningham, J.E., Jan, W.Y.

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Demultiplexing 2.48-Gb/s optical signals with a CMOS receiver array based on clocked-sense-amplifiers von Woodward, T.K., Lentine, A.L., Goossen, K.W., Walker, J.A., Tseng, B.T., Hui, S.P., Lothian, J., Leibenguth, R.E.

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Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal von Kuo, J.M., Wang, Y.C., Goossen, K.W., Chirovsky, L.M.F., Hui, S.P., Tseng, B.T., Walker, J., Lentine, A.L., Leibenguth, R.E., Livescu, G., Jan, W.Y., Cunningham, J.E., D'Asaro, L.A., Ron, A., Dahringer, D., Kossives, D., Bacon, D.D., Morrison, R.L., Novotny, R.A., Buchholz, D.B., Mayo, W.E.

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15 /spl mu/m solder bonding of GaAs/AlGaAs MQW devices to MOSIS 0.8 /spl mu/m CMOS for 1 Gb/s two-beam smart-pixel receiver/transmitter von Woodward, T.K., Krishnamoorthy, A.V., Goossen, K.W., Walker, J.A., Lentine, A.L., Novotny, R.A., D'Asaro, L.A., Chirovsky, L.M.F., Hui, S.P., Tseng, B., Kossives, D., Dahringer, D., Leibenguth, R.E., Cunningham, J.E., Jan, W.Y., Miller, D.A.B.

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GaAs Mqw Modulators On Silicon IC's von Goossen, K.W., Walker, J.A., DAsaro, L.A., Hui, S.P., Cunningham, J.E., Jan, W.Y.

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Multiple attachment GaAs-on-Si hybrid optoelectronic/VLSI chips von Goossen, K.W., Tseng, B., Hui, S.P., Walker, J.A., Leibenguth, R., Chirovsky, L.M.F., Krishnamoort, A.

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Operation of a 50-element two-dimensional smart-pixel receiver array von Woodward, T.K., Lentine, A.L., Krishnamoorthy, A.V., Goossen, K.W., Walker, J.A., Cunningham, J.E., Jan, W.Y., Tseng, B.T., Hui, S.P., Leibenguth, R.E.

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Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS von Lentine, A.L., Goossen, K.W., Walker, J.A., Chirovsky, L.M.F., D'Asaro, L.A., Hui, S.P., Tseng, B.T., Leibenguth, R.E., Cunningham, J.E., Jan, W.Y., Kuo, J.M., Dahringer, D., Kossives, D., Bacon, D.D., Livescu, G., Morrison, R.L., Novotny, R.A., Buchholz, D.B.

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