Development of a computer-integrated system to support CAD to CAPP von Lau, H.C.W., Lee, C.K.M., Jiang, B., Hui, I.K., Pun, K.F.

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A parametric investigation of arc spraying process for rapid mould making von Hui, I. K., Hua, M., Lau, H. C. W.

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Precise effects of control position, indicator type, and scale side on human performance von Chan, Alan H. S., Shum, Vicki W. Y., Law, H. W., Hui, I. K.

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Design and implementation of an integrated knowledge system von Lau, H.C.W, Wong, C.W.Y, Hui, I.K, Pun, K.F

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Dioscin inhibits adipogenesis through the AMPK/MAPK pathway in 3T3-L1 cells and modulates fat accumulation in obese mice von POUDEL, BARUN, LIM, SEONG-WON, KI, HYEON-HUI, NEPALI, SARMILA, LEE, YOUNG-MI, KIM, DAE-KI

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A dynamic inventory-production scheduling model for small scale organisations von Hui, I. K., Lau, H. C. W.

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An environmental assessment model applied to printed circuit board manufacturing von Hui, I. K.

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Hierarchical environmental impact evaluation of a process in printed circuit board manufacturing von Hui, I. K., Li, C. P., Lau, H. C. W.

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An Environmental Impact Scoring System for Manufactured Products von Hui, I.K., Lau, H.C.W., Chan, H.S., Lee, K.T.

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A study of the Environmental Management System implementation practices von Hui, I.K, Chan, Alan H.S, Pun, K.F

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Environmental impact evaluation model for industrial processes von Li, C P, Hui, I K

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Limit analysis on surface roughness and dimensional accuracy of spray metallic crust for rapid tooling production by metal arc spraying process von Hua, M., Lau, C. C., Hui, I. K., Li, J.

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Wetting Analysis of Leadless Chips in Surface Mount Technology von Hui, I. K., Ipyn, W. L. R.

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Monitoring the supply of products in a supply chain environment: a fuzzy neural approach von Lau, H.C.W., Hui, I.K., Chan, Felix T.S., Wong, Christina W.Y.

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Voiding and printing characteristics of solder paste at different degrees of exposure von Hui, I K, Ralph, B

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Object-oriented knowledge-based computer-aided process planning system for bare circuit boards manufacturing von Law, Hang-Wai, Tam, Hon-Yuen, Chan, Alan H.S, Hui, I.K

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An alternative approach for the analysis of intermetallic compounds in SMT solder joints von Hui, I.K, Law, H.W

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Environmental impact assessment in an uncertain environment von Hui, I. K., He, L., Dang, C.

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Effect of step wise variation of oxygen potential during the isothermal sintering on the grain growth behavior in Cr2O3 doped UO2 pellets von Yang, Jae Ho, Kim, Keon Sik, Nam, Ik Hui, Oh, Jang Soo, Kim, Dong-Joo, Rhee, Young Woo, Kim, Jong Hun

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On an adaptive product development system a hybrid database approach von Lee, K.M., Lau, H.C.W., Hui, I.K., Yu, K.M.

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