Device packaging and integration optimization based on neural network method: Effect of microchannel structure on heat sink performance von Liu, Yang, Lv, Shiqing, Cui, Qiulang, Xia, Yangjing, Jiang, Mengxia, Lv, Jun, Huang, Mairui, Xue, Yuxiong

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Reinforcing structure and reinforcing method for wafer-level RDL stress sensitive area von HUANG MAIRUI, ZHANG YOUXIN, WU CHENCHENG, LIU YANG

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Preparation method of novel resin through hole adapter plate von HUANG MAIRUI, ZHANG YOUXIN, GENG JING, LIU YANG

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Manufacturing method for semiconductor imaging sensor device von HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU

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Low stress wafer level image chip package structure von HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU

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Optical information sensing device von HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU

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Wafer-level image senor von HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU

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Manufacturing process for image sensing device von HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU

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CMOS image sensor spare von HUANG MAIRUI, CHEN JIE, LIU CHEN, HUANG SHUANGWU

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Novel vehicle-mounted antenna structure von JIANG XIAOYAN, PENG MAIRUI, PENG YIMING, ZHANG CHAO, WANG ZHE, XIONG JIXING, YANG QING, HUANG LUOPING

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