NiO electrode for methanol electro-oxidation: Mesoporous vs. nanoparticulate von Gu, C.D., Huang, M.L., Ge, X., Zheng, H., Wang, X.L., Tu, J.P.

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Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders von Ren, J., Huang, F.F., Huang, M.L.

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NiO nanoflakes grown on porous graphene frameworks as advanced electrochemical pseudocapacitor materials von Huang, M.L., Gu, C.D., Ge, X., Wang, X.L., Tu, J.P.

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Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient von Zhao, N., Zhong, Y., Huang, M.L., Ma, H.T., Dong, W.

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In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction von Qu, L., Zhao, N., Zhao, H.J., Huang, M.L., Ma, H.T.

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In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology von Ma, H.T., Qu, L., Huang, M.L., Gu, L.Y., Zhao, N., Wang, L.

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A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn–9Zn/Cu interconnect during liquid–solid electromigration von Huang, M.L., Zhang, Z.J., Zhao, N., Zhou, Q.

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In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration von Huang, M.L., Zhang, Z.J., Zhao, N., Yang, F.

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Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect von Chen, L.D., Huang, M.L., Zhou, S.M.

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Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model von Huang, M.L., Yang, Y.C., Chen, Y., Dong, C.

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In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction von Huang, M.L., Yang, F., Zhao, N., Zhang, Z.J.

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Atomic-layer-deposited Al2O3 and HfO2 on GaN: A comparative study on interfaces and electrical characteristics von CHANG, Y. C, HUANG, M. L, CHANG, Y. H, LEE, Y. J, CHIU, H. C, KWO, J, HONG, M

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Transcriptome-sequencing analyses reveal flower color formation in Strelitzia reginae von Fan, R. H., Lin, B., Fang, N. Y., Ye, X. X., Huang, M. L., Zhong, H. Q.

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Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu Joints von Huang, M.L., Kang, N., Zhou, Q., Huang, Y.Z.

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Mechanism on scalloped Cu6Sn5 grain refinement under interaction of Cu and Ni von Kuang, J.M., Huang, M.L.

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P.2.b.009 Abnormality of white matter structure and resting state brain function in drug naive patients with major depressive disorder von Huang, M.L, Yu, L, Wei, N, Hu, J.B, Lou, B.Y, Xu, Y

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Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate von Wu, Y., Huang, M.L.

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In situ atomic layer deposition and synchrotron-radiation photoemission study of Al2O3 on pristine n-GaAs(001)-4×6 surface von Chang, Y.H., Huang, M.L., Chang, P., Shen, J.Y., Chen, B.R., Hsu, C.L., Pi, T.W., Hong, M., Kwo, J.

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Cellular iron uptake, trafficking and metabolism: Key molecules and mechanisms and their roles in disease von Lane, D.J.R., Merlot, A.M., Huang, M.L.-H., Bae, D.-H., Jansson, P.J., Sahni, S., Kalinowski, D.S., Richardson, D.R.

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Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration von Huang, M.L., Zhao, J.F., Zhang, Z.J., Zhao, N.

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