Failure Mechanisms Associated With Lens Shape of High-Power LED Modules in Aging Test von HSU, Cheng, LIN, Yu-Kuan, CHEN, Ming-Hung, TSAI, Chun-Chin, KUANG, Jao-Hwa, HUANG, Sheng-Bang, HU, Hung-Lieh, SU, Yeh-I, CHENG, Wood-Hi

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Novel Electrode Design for Integrated Thin-Film GaN LED Package With Efficiency Improvement von Tsai, Yao-Jun, Lin, Re-Ching, Hu, Hung-Lieh, Hsu, Chen-Peng, Wen, Shih-Yi, Yang, Chi-Chin

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Performance of Flip-Chip Thin-Film GaN Light-Emitting Diodes With and Without Patterned Sapphires von Horng, R.-H., Hung-Lieh Hu, Mu-Tao Chu, Yu-Li Tsai, Yao-Jun Tsai, Chen-Peng Hsu, Dong-Sing Wuu

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Enhancement of Light Extraction for InGaN LEDs by Means of Beveled Sapphire and Cup-Shaped Copper Sheeting von Horng, Ray-Hua, Hu, Hung-Lieh, Ou, Sin-Liang, Lin, Re-Ching, Hsu, Chen-Peng

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Decay Mechanisms of Radiation Pattern and Optical Spectrum of High-Power LED Modules in Aging Test von Tsai, Chun-Chin, Chen, Ming-Hung, Huang, Yi-Chung, Hsu, Yi-Cheng, Lo, Yuan-Tsun, Lin, Ying-Jyun, Kuang, Jao-Hwa, Huang, Sheng-Bang, Hu, Hung-Lieh, Su, Yeh-I, Cheng, Wood-Hi

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A novel integrated structure of thin film GaN LED with ultra-low thermal resistance von Wen, Shih-Yi, Hu, Hung-Lieh, Tsai, Yao-Jun, Hsu, Chen-Peng, Lin, Re-Ching, Horng, Ray Hua

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Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology von Horng, Ray-Hua, Lin, Re-Ching, Chiang, Yi-Chen, Chuang, Bing-Han, Hu, Hung-Lieh, Hsu, Chen-Peng

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Improved Design of Cup-Shaped Copper Heat Spreaders for High-Power InGaN/Sapphire LEDs von Hu, Hung-Lieh, Horng, Ray-Hua, Hsu, Chen-Peng

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(Invited) High Thermal Dissipation Apparatus for UV LEDs Application von Horng, Ray-Hua, Hu, Hung-Lieh, Lin, Re-Ching, Chiang, Yi-Chen

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Cup-shaped copper heat spreader in multi-chip high-power LEDs application von Horng, Ray Hua, Hu, Hung Lieh, Lin, Re Ching, Tang, Li Shen, Hsu, Chen Peng, Ou, Sin Liang

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A novel integrated structure of thin film GaN LED with ultra-low thermal resistance: erratum von Wen, Shih-Yi, Hu, Hung-Lieh, Tsai, Yao-Jun, Hsu, Chen-Peng, Lin, Re-Ching, Horng, Ray Hua

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High thermal stability of high-power phosphor based white-light-emitting diodes employing Ce:YAG-doped glass von Chun-Chin Tsai, Cheng-Hsun Chung, Wang, Jimmy, Wei-Chih Cheng, Ming-Hung Chen, Jyun-Sian Liou, Jin-Kai Chang, Yi-Cheng Hsu, Shang-Chao Hung, Chao-Wei Lee, Hung-Lieh Hu, Sheng-Bang Huang, Jao-Hwa Kuang, Wood-Hi Cheng

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Diamond-Added-Copper Heat Spreader for UV LED Applications von Horng, Ray-Hua, Lin, Re-Ching, Hu, Hung-Lieh, Peng, Kun-Cheng, Hsu, Chen-Peng

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Thermal Behavior of Sapphire-Based InGaN Light-Emitting Diodes with Cap-Shaped Copper–Diamond Substrates von Horng, Ray-Hua, Hu, Hung-Lieh, Lin, Re-Ching, Peng, Kun-Cheng, Chiang, Yi-Chen

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Investigation of Ce:YAG Doping Effect on Thermal Aging for High-Power Phosphor-Converted White-Light-Emitting Diodes von Chun-Chin Tsai, Yi-Cheng Hsu, Sheng-Bang Huang, Ying-Jyun Lin, Wang, J., Ming-Hung Chen, Chao-Wei Lee, Hung-Lieh Hu, Wood-Hi Cheng

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Effect of the Flat and Pattern Surface Texturing on Light Extraction of GaN Flip-Chip Light-Emitting Diodes von Horng, Ray-Hua, Liao, Zi-Wei, Tsai, Yu-Li, Hu, Hung Lieh, Tsai, Yao-Jun, Hsu, Chen-Peng, Chu, Mu-Tao

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Thermal image sensing system and thermal image sensing method von Fu, Han-Kuei, Wen, Shih-Yi, Hu, Hung-Lieh, Chang, Hsueh-Chih

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Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology: Reliability of High-Power LED Packaging and Assembly von HORNG, Ray-Hua, LIN, Re-Ching, CHIANG, Yi-Chen, CHUANG, Bing-Han, HU, Hung-Lieh, HSU, Chen-Peng

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Light source module, sensing device and method for generating superposition structured patterns von Lin, Jui-Ying, Chu, Mu-Tao, Hu, Hung-Lieh, Chang, Hsueh-Chih

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THERMAL IMAGE SENSING SYSTEM AND THERMAL IMAGE SENSING METHOD von Fu, Han-Kuei, Wen, Shih-Yi, Hu, Hung-Lieh, Chang, Hsueh-Chih

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