Peromyscus burrowing: A model system for behavioral evolution von Hu, Caroline K., Hoekstra, Hopi E.

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Exact Solution of the Eigen Model with General Fitness Functions and Degradation Rates von Saakian, David B., Hu, Chin-Kun

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Free energy landscape and folding mechanism of a β-hairpin in explicit water: A replica exchange molecular dynamics study von Nguyen, Phuong H., Stock, Gerhard, Mittag, Emil, Hu, Chin-Kun, Li, Mai Suan

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Electromigration of Cu/low dielectric constant interconnects von Hu, C.-K., Gignac, L., Rosenberg, R.

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Reduced electromigration of Cu wires by surface coating von Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Domenicucci, A., Chen, X., Stamper, A. K.

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Electromigration path in Cu thin-film lines von Hu, C.-K., Rosenberg, R., Lee, K. Y.

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Microstructure, impurity and metal cap effects on Cu electromigration von C-K, Hu, Gignac, L G, Ohm, J, Breslin, C M, Huang, E, Bonilla, G, Liniger, E, Rosenberg, R, Choi, S, Simon, A H

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Mechanisms for microstructure evolution in electroplated copper thin films near room temperature von Harper, J. M. E., Cabral, C., Andricacos, P. C., Gignac, L., Noyan, I. C., Rodbell, K. P., Hu, C. K.

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Synchronized state of coupled dynamics on time-varying networks von Amritkar, R. E., Hu, Chin-Kun

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Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps von Hu, C.-K., Gignac, L., Liniger, E., Herbst, B., Rath, D. L., Chen, S. T., Kaldor, S., Simon, A., Tseng, W.-T.

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3D imaging of semiconductor components by discrete laminography von Batenburg, K J, Palenstijn, W J, Sijbers, J

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An enhanced version of SMMP—open-source software package for simulation of proteins von Eisenmenger, Frank, Hansmann, Ulrich H.E., Hayryan, Shura, Hu, Chin-Kun

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Logarithmic conformal field theory and boundary effects in the dimer model von Izmailian, N Sh, Priezzhev, V B, Ruelle, Philippe, Hu, Chin-Kun

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Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques von Auersperg Jürgen, Vogel, Dietmar, Auerswald, Ellen, Rzepka Sven, Michel, Bernd

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Copper interconnections and reliability von Hu, C.-K., Harper, J.M.E.

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Thermomechanical characterization and modeling for TSV structures von Jiang Tengfei, Suk-Kyu, Ryu, Zhao, Qiu, Im, Jay, Ho, Paul S, Huang, Rui

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Parallel tempering simulations of HP-36 von Lin, Chai-Yu, Hu, Chin-Kun, Hansmann, Ulrich H. E.

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Reduced Cu interface diffusion by CoWP surface coating von Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Stamper, A., Domenicucci, A., Chen, X.

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[SMMP] A modern package for simulation of proteins von Eisenmenger, Frank, Hansmann, Ulrich H.E., Hayryan, Shura, Hu, Chin-Kun

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Stress management for 3D through-silicon-via stacking technologies - The next frontier von Riko, Radojcic, Nowak, Matt, Nakamoto, Mark

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