Geometry and heat loss in channel flow of a fluid with temperature-dependent density von Bechtel, Stephen E., Cao, Dongbu, Hsiao, Hsien-fu

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Role of adhesive modulus on reliability of FCBGA with heat spreader von Hsien-Fu Hsiao

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Dynamic-SUPERB Phase-2: A Collaboratively Expanding Benchmark for Measuring the Capabilities of Spoken Language Models with 180 Tasks von Huang, Chien-yu, Chen, Wei-Chih, Yang, Shu-wen, Liu, Andy T, Li, Chen-An, Lin, Yu-Xiang, Tseng, Wei-Cheng, Diwan, Anuj, Shih, Yi-Jen, Shi, Jiatong, Chen, William, Chen, Xuanjun, Hsiao, Chi-Yuan, Peng, Puyuan, Wang, Shih-Heng, Kuan, Chun-Yi, Lu, Ke-Han, Chang, Kai-Wei, Yang, Chih-Kai, Ritter-Gutierrez, Fabian, Chuang, Ming To, Huang, Kuan-Po, Arora, Siddhant, Lin, You-Kuan, Yeo, Eunjung, Chang, Kalvin, Chien, Chung-Ming, Choi, Kwanghee, Hsieh, Cheng-Hsiu, Lin, Yi-Cheng, Yu, Chee-En, Chiu, I-Hsiang, Guimarães, Heitor R, Han, Jionghao, Lin, Tzu-Quan, Lin, Tzu-Yuan, Chang, Homu, Chang, Ting-Wu, Chen, Chun Wei, Chen, Shou-Jen, Chen, Yu-Hua, Cheng, Hsi-Chun, Dhawan, Kunal, Fang, Jia-Lin, Fang, Shi-Xin, Chiang, Kuan-Yu Fang, Fu, Chi An, Hsiao, Hsien-Fu, Hsu, Ching Yu, Huang, Shao-Syuan, Wei, Lee Chen, Lin, Hsi-Che, Lin, Hsuan-Hao, Lin, Hsuan-Ting, Lin, Jian-Ren, Liu, Ting-Chun, Lu, Li-Chun, Pai, Tsung-Min, Pasad, Ankita, Kuan, Shih-Yun Shan, Shon, Suwon, Tang, Yuxun, Tsai, Yun-Shao, Wei, Jui-Chiang, Wei, Tzu-Chieh, Wu, Chengxi, Wu, Dien-Ruei, Yang, Chao-Han Huck, Yang, Chieh-Chi, Yip, Jia Qi, Yuan, Shao-Xiang, Noroozi, Vahid, Chen, Zhehuai, Wu, Haibin, Livescu, Karen, Harwath, David, Watanabe, Shinji, Lee, Hung-yi

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Dynamic-SUPERB Phase-2: A Collaboratively Expanding Benchmark for Measuring the Capabilities of Spoken Language Models with 180 Tasks von Chien-yu, Huang, Chen, Wei-Chih, Shu-wen, Yang, Liu, Andy T, Chen-An, Li, Yu-Xiang, Lin, Wei-Cheng, Tseng, Diwan, Anuj, Yi-Jen Shih, Shi, Jiatong, Chen, William, Chen, Xuanjun, Chi-Yuan, Hsiao, Peng, Puyuan, Shih-Heng, Wang, Chun-Yi, Kuan, Ke-Han, Lu, Kai-Wei, Chang, Chih-Kai, Yang, Ritter-Gutierrez, Fabian, Ming To Chuang, Kuan-Po Huang, Arora, Siddhant, You-Kuan, Lin, Yeo, Eunjung, Chang, Kalvin, Chung-Ming, Chien, Choi, Kwanghee, Cheng-Hsiu Hsieh, Yi-Cheng, Lin, Chee-En Yu, I-Hsiang, Chiu, Guimarães, Heitor R, Han, Jionghao, Lin, Tzu-Quan, Lin, Tzu-Yuan, Chang, Homu, Ting-Wu, Chang, Chun Wei Chen, Shou-Jen Chen, Yu-Hua, Chen, Hsi-Chun, Cheng, Dhawan, Kunal, Jia-Lin, Fang, Shi-Xin, Fang, Kuan-Yu, Fang Chiang, Chi An Fu, Hsien-Fu Hsiao, Ching Yu Hsu, Huang, Shao-Syuan, Lee Chen Wei, Hsi-Che Lin, Hsuan-Hao, Lin, Hsuan-Ting, Lin, Jian-Ren, Lin, Ting-Chun, Liu, Li-Chun, Lu, Tsung-Min Pai, Pasad, Ankita, Shih-Yun, Shan Kuan, Shon, Suwon, Tang, Yuxun, Yun-Shao, Tsai, Jui-Chiang, Wei, Wei, Tzu-Chieh, Wu, Chengxi, Wu, Dien-Ruei, Chao-Han, Huck Yang, Chieh-Chi Yang, Jia Qi Yip, Shao-Xiang, Yuan, Noroozi, Vahid, Chen, Zhehuai, Wu, Haibin, Livescu, Karen, Harwath, David, Watanabe, Shinji, Hung-yi, Lee

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Method for fabricating a semiconductor integrated chip von Hsiao, Hsien-Fu, Lin, Cheng-Kuo, Hua, Chang-Hwang, Takatani, Shinichiro

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Semiconductor integrated circuit von Lin Cheng-Kuo, Hua Chang-Hwang, Takatani Shinichiro, Hsiao Hsien-Fu

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Method for Fabricating a Semiconductor Integrated Chip von TAKATANI Shinichiro, HUA Chang-Hwang, LIN Cheng-Kuo, Hsiao Hsien-Fu

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SEMICONDUCTOR INTEGRATED CIRCUIT von HUA CHANG-HWANG, TAKATANI SHINICHIRO, HSIAO HSIEN-FU, LIN CHENG-KUO

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Compound semiconductor integrated circuit von TAKATANI SHINICHIRO, HSIAO HSIEN-FU, WU YU-KAI

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SEMICONDUCTOR INTEGRATED CIRCUIT von TAKATANI SHINICHIRO, HSIAO HSIEN-FU, LIN CHENG-KUO, HUA CHANG HWANG

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SEMICONDUCTOR INTEGRATED CIRCUIT von HUA CHANG-HWANG, TAKATANI SHINICHIRO, HSIAO HSIEN-FU, LIN CHENG-KUO

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COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT von TAKATANI SHINICHIRO, HSIAO HSIEN-FU, WU YU-KAI

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COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT von TAKATANI SHINICHIRO, HSIAO HSIEN-FU, WU YU-KAI

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Semiconductor integrated circuit von LIN, CHENG KUO, HUA, CHANG HWANG, HSIAO, HSIEN FU, TAKATANI, SHINICHIRO

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Compound semiconductor integrated circuit von HSIAO, HSIEN FU, WU, YU KAI, TAKATANI, SHINICHIRO

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Semiconductor integrated circuit von HUA CHANG-HWANG, TAKATANI SHINICHIRO, HSIAO HSIEN-FU, LIN CHENG-KUO

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Semiconductor integrated circuit von HUA, CHANG-HWANG, LIN, CHENG-KUO, TAKATANI, SHINICHIRO, HSIAO, HSIEN-FU

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Compound semiconductor integrated circuit von TAKATANI SHINICHIRO, HSIAO HSIEN-FU, WU YU-KAI

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Compound semiconductor integrated circuit von WU, YU-KAI, TAKATANI, SHINICHIRO, HSIAO, HSIEN-FU

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Fabricating method of solder bump von HUANG, CHUNIEH, YEH, CHING-KUN, HUANG, TZU-WEI, LIU, LIANGI, HSIAO, HSIEN-FU

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