Preparation and Characterization of Superconducting Y–Ba–Cu–O Films by the MOCVD Technique von Ohnishi, Hiroshi, Kusakabe, Yoshihiko, Kobayashi, Minoru, Hoshinouchi, Susumu, Harima, Hiroshi, Tachibana, Kunihide

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Preparation of nearly stoichiometric superconducting Y-Ba-Cu-O films by an MOCVD technique using ozone von OHNISHI, H, HARIMA, H, KUSAKABE, Y, KOBAYAHSI, M, HOSHINOUCHI, S, TACHIBANA, K

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Technical Information. Special Issue. Laser Soldering of TCP in SMT Assembly von Murakami, Kohei, Hoshinouchi, Susumu

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Prediction of Thermal-Cycle Life for Plated Through Hole Based on Thermal-Stress Analysis von KITAMURA, Yoichi, TAKAHAMA, Takashi, HOSHINOUCHI, Susumu

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Welding Characteristics of Ring Mode 5kW CO2 Laser von TAKAHAMA, Toru, MORIYASU, Masaharu, FUKADA, Atsushi, HIRAMOTO, Seigo, HOSHINOUCHI, Susumu, OHMINE, Megumi, MYOI, Yasuhito

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LIQUID CRYSTAL DISPLAY DEVICE von HOSHINOUCHI SUSUMU, MATSUBARA NORIYUKI

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Spectroscopic study on a discharge plasma of MOCVD source gases for high-Tc superconducting films von HARIMA, H, OHNISHI, H, HANAOKA, K.-I, TACHIBANA, K, KOBAYASHI, M, HOSHINOUCHI, S

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LASER BEAM MACHINE von HOSHINOUCHI SUSUMU

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Fatigue Strength at Toe of Welded Joint von INOUE, Akio, YOSHIOKA, Sumio, HOSHINOUCHI, Susumu, SAWAKI, Yozo

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LASER WORKING DEVICE von HOSHINOUCHI SUSUMU

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LASER WORKING DEVICE von HOSHINOUCHI SUSUMU

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Laser Soldering of TCP in SMT Assembly von Murakami, Kohei, Hoshinouchi, Susumu

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Study of a Laser Soldering Process for Fine-Pitch Leads (1st Report): Substantiation of the New Technique and Solder Flow Control von MURAKAMI, Kohei, ADACHI, Akira, HIROTA, Jitsuho, HAYASHI, Osamu, HOSHINOUCHI, Susumu

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An Introduction to Chemical Vapor Deposition von Kobayashi, Minoru, Hoshinouchi, Susumu

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Study of a Laser Soldering Process for Fine-Pitch Leads (3rd Report): Development of Fluxless Laser Soldering von MURAKAMI, Kohei, ADACHI, Akira, HIROTA, Jitsuho, YOSHIDA, Masaharu, HAYASHI, Osamu, MORIHIRO, Yoshiyuki, HOSHINOUCHI, Susumu

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Study of a Laser Soldering Process for Fine-Pitch Leads (2nd Report): Development of the High Speed Soldering Process by a New Beam-Scanning Technique von MURAKAMI, Kohei, ADACHI, Akira, HIROTA, Jitsuho, HAYASHI, Osamu, HOSHINOUCHI, Susumu, SAKAO, Masayoshi

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Mixture thin film forming apparatus von HOSHINOUCHI, SUSUMU, OHNISHI, HIROSHI

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ELECTRON EMITTING APPARATUS von MORITA NORIKO, HOSHINOUCHI SUSUMU

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THIN HIGH TEMPERATURE HEATER AND MANUFACTURE THEREOF von MORITA NORIKO, HOSHINOUCHI SUSUMU

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MANUFACTURE OF THREE-DIMENSIONAL PRINTED WIRING BOARD von HOSHINOUCHI SUSUMU, FUJITA MINORU

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