Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections von Lin, Yu-Tien, Huang, Hsin-Man, Wang, Hsin-Wei, Dow, Wei-Ping, Lin, Jing-Yuan, Chang, Ping-He, Lee, Horn-Chin

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Image sensing apparatus von Lee, Horn-Chin, Chang, Chia-Jung, Hsu, Chih-Hao, Lin, Jing-Yuan

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IMAGE SENSING APPARATUS von Lee, Horn-Chin, Chang, Chia-Jung, Hsu, Chih-Hao, Lin, Jing-Yuan

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The Effect of Polymer Additives on TSV Filling by Copper Electroplating von Lin, Chia-Chen, Dow, Wei-Ping, Lin, Jing-Yuan, Chang, Wu-Chung, Lee, Horn-Chin

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Copper-free Through Silicon Via Filling by Ni-W Electrodeposition von Huang, Hsin-Man, Dow, Wei-Ping, Lin, Jing-Yuan, Chang, Wu-Chung, Lee, Horn-Chin

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Periodic Pulse Reverse Cu Electroplating for Through Hole Filling von Shen, Fang-Yu, Dow, Wei-Ping, Lin, Jing-Yuan, Chang, Wu-Chung, Lee, Horn-Chin

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Cu Electroplating for Through Silicon Vias (TSVs) Filling Using a Dimensionally Stable Anode (DSA) von Hsiung, Wan Yun, Dow, Wei-Ping, Lin, Jing-Yuan, Chang, Wu-Chung, Lee, Horn-Chin, Lin, Shih-Min

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Microfabrication of asymmetric planar electrodes for long-term glucose monitoring von Chih-Hsiu Yin, Shaw-Hwa Parng, Jui-Tse Chen, Kun-Feng Lee, Chu-Hsuan Chen, Tsung-Che Chou, Yun-Ju Chuang, Horn-Chin Lee, Yuh-Jiuan Lin

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SCANNING GRATING SPECTROMETER von CHANG, CHIA JUNG, CHEN, CHUNG DE, HUANG, CHIUNG CHENG, LIN, JING YUAN, SU, SHANG CHIAN, LEE, HORN CHIN

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