Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces von Whelan, Caroline M., Kinsella, Michael, Carbonell, Laureen, Meng Ho, Hong, Maex, Karen

Volltext

Corrosion inhibition by thiol-derived SAMs for enhanced wire bonding on Cu surfaces von WHELAN, Caroline M, KINSELLA, Michael, HONG MENG HO, MAEX, Karen

Volltext

Wire-bonding process development for low- k materials von Tan, Jonathan, Zhong, Zhao Wei, Ho, Hong Meng

Volltext

Direct gold and copper wires bonding on copper von Ho, Hong Meng, Lam, Wai, Stoukatch, Serguei, Ratchev, Petar, Vath, Charles J., Beyne, Eric

Volltext

In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding von WHELAN, Caroline M, KINSELLA, Michael, HONG MENG HO, MAEX, Karen

Volltext

Investigation of Palladium Distribution on the Free Air Ball of Pd-coated Cu wire von Lei-Jun Tang, Hong-Meng Ho, Yue-Jia Zhang, Yuet-Mun Lee, Che-Wei Lee

Volltext bestellen

Pitfalls and solutions of replacing gold wire with palladium coated copper wire in IC wire bonding von Lei-Jun Tang, Hong-Meng Ho, Wei Koh, Yue-Jia Zhang, Kay-Soon Goh, Chun-Shu Huang, Yung-Tsan Yu

Volltext

Investigation of palladium coverage on bonded balls of palladium-coated copper wires von Wei Koh, Teck-Kheng Lee, Hun-Shen Ng, Kay-Soon Goh, Hong-Meng Ho

Volltext bestellen

Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System von Wayne Yong, Cai Xiao Jin, Hong Meng Ho

Volltext bestellen

Modelling of free air ball for copper wire bonding von Tan, J., Boon Hoe Toh, Hong Meng Ho

Volltext bestellen

Direct Au and Cu wire bonding on Cu/low-k BEOL von Banda, P., Hong Meng Ho, Whelan, C., Wai Lam, Vath, C.J., Beyne, E.

Volltext bestellen

Fine pitch copper wire bonding on copper bond pad process optimization von Kan Wai Lam, Hong Meng Ho, Stoukatch, S., Van De Peer, M., Ratchev, P., Vath, C.J., Schervan, A., Beyne, E.

Volltext bestellen

Bonding on Cu: a new stress evaluation approach by Raman spectroscopy von Jian Chen, Hong Meng Ho, Wai Lam, Ratchev, P., Stoukatch, S., Beyne, E., Vath, C.J., De Wolf, I.

Volltext bestellen

Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT von Stoukatch, S., Vaesen, K., Ho Hong Meng, Beyne, E.

Volltext

Advanced copper wire bonding technology von Ho, Hong Meng

Volltext

ENHANCED RELIABILITY BALL GRID ARRAY PACKAGE von HO HONG MENG, HONG MENG HO, TEO YONG CHUA, THIAM BENG LIM, YONG CHUA TEO, LIM THIAM BENG

Volltext bestellen

Recent Findings on Cell-Based Therapies for COVID19-Related Pulmonary Fibrosis von Chuang, Hong-Meng, Ho, Li-Ing, Harn, Horng-Jyh, Liu, Ching-Ann

Volltext

Modeling energy transfer to copper wire for bonding in an inert environment von Hong Meng Ho, Tan, J., Yee Chen Tan, Boon Hoe Toh, Xavier, P.

Volltext bestellen

Mesenchymal Stem Cell Therapy of Pulmonary Fibrosis: Improvement with Target Combination von Chuang, Hong-Meng, Shih, Tina Emily, Lu, Kang-Yun, Tsai, Sheng-Feng, Harn, Horng-Jyh, Ho, Li-Ing

Volltext

Enhancements on Flame Resistance by Inorganic Silicate-Based Intumescent Coating Materials von Chen, Sin-Nan, Li, Pei-Kai, Hsieh, Tar-Hwa, Ho, Ko-Shan, Hong, Yu-Meng

Volltext