Novel Cu-to-Cu Bonding With Ti Passivation at 180 ^ in 3-D Integration von Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Chiou, Jin-Chern, Chuang, Ching-Te, Hwang, Wei, Tong, Ho-Ming, Chen, Kuan-Neng

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Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration von Chien, Yu-San, Huang, Yan-Pin, Tzeng, Ruoh-Ning, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Chuang, Ching-Te, Hwang, Wei, Chiou, Jin-Chern, Tong, Ho-Ming, Chen, Kuan-Neng

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Revealing the beneficial role of K in grain interiors, grain boundaries, and at the buffer interface for highly efficient CuInSe2 solar cells von Muzzillo, Christopher P., Poplawsky, Jonathan D., Tong, Ho Ming, Guo, Wei, Anderson, Tim

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A TSV-Based Bio-Signal Package With \mu -Probe Array von Chou, Lei-Chun, Lee, Shih-Wei, Huang, Po-Tsang, Chang, Chih-Wei, Chiang, Cheng-Hao, Wu, Shang-Lin, Chuang, Ching-Te, Chiou, Jin-Chern, Hwang, Wei, Wu, Chung-Hsi, Chen, Kuo-Hua, Chiu, Chi-Tsung, Tong, Ho-Ming, Chen, Kuan-Neng

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Reaction Rate Enhancement for Cu(In,Ga)Se2 Absorber Materials Using Ag-Alloying von Soltanmohammad, Sina, Tong, Ho Ming, Anderson, Timothy J., Shafarman, William N.

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2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications von Huang, Po-Tsang, Wu, Shang-Lin, Huang, Yu-Chieh, Chou, Lei-Chun, Huang, Teng-Chieh, Wang, Tang-Hsuan, Lin, Yu-Rou, Cheng, Chuan-An, Shen, Wen-Wei, Chuang, Ching-Te, Chen, Kuan-Neng, Chiou, Jin-Chern, Hwang, Wei, Tong, Ho-Ming

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Single-Walled Aluminosilicate Nanotube/Poly(vinyl alcohol) Nanocomposite Membranes von Kang, Dun-Yen, Tong, Ho Ming, Zang, Ji, Choudhury, Rudra Prosad, Sholl, David S, Beckham, Haskell W, Jones, Christopher W, Nair, Sankar

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Through-silicon-via-based double-side integrated microsystem for neural sensing applications von Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong

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A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications von Chang, Chih-Wei, Chou, Lei-Chun, Huang, Po-Tsang, Wu, Shang-Lin, Lee, Shih-Wei, Chuang, Ching-Te, Chen, Kuan-Neng, Hwang, Wei, Chen, Kuo-Hua, Chiu, Chi-Tsung, Tong, Ho-Ming, Chiou, Jin-Chern

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Recent research advances in Pb-free solders von Lai, Yi-Shao, Tong, Ho-Ming, Tu, King-Ning

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TSV technology for 2.5D IC solution von Meng-Jen Wang, Chang-Ying Hung, Chin-Li Kao, Pao-Nan Lee, Chi-Han Chen, Chih-Pin Hung, Ho-Ming Tong

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Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection von Ming-Hung Chang, Shang-Yuan Lin, Pei-Chen Wu, Zakoretska, Olesya, Ching-Te Chuang, Kuan-Neng Chen, Chen-Chao Wang, Kua-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang

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Chemistry of K in Cu(In,Ga)Se2 photovoltaic absorbers: Effects of temperature on Cu-K-In-Se films von Muzzillo, Christopher P., Tong, Ho Ming, Anderson, Tim

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Microelectronics packaging: present and future von Tong, Ho-Ming

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Chemistry of K in Cu(In,Ga)Se^sub 2^ photovoltaic absorbers: Effects of temperature on Cu-K-In-Se films von Muzzillo, Christopher P, Tong, Ho Ming, Anderson, Tim

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Thickness-direction thermal-expansion measurements von Saraf, Ravi F., Tong, Ho-Ming, Poon, Tze W., Silverman, B. David, Ho, Paul S., Rossi, Angelo R.

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The effect of Na on Cu-K-In-Se thin film growth von Muzzillo, Christopher P., Tong, Ho Ming, Anderson, Timothy J.

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Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies von Chang-Lin Yeh, Yung-Yi Yeh, Jen-Chieh Kao, Tong Hong Wang, Chang-Chi Lee, Ho-Ming Tong

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Low temperature (<180°C) wafer-level and chip-level In-to-Cu and Cu-to-Cu bonding for 3D integration von Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen

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Cover Image, Volume 26, Issue 10 von Muzzillo, Christopher P., Poplawsky, Jonathan D., Tong, Ho Ming, Guo, Wei, Anderson, Tim

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