Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders von HO, C. E, YANG, S. C, KAO, C. R

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P4366Application of 3D-dual volume layout imaging for rapid intraprocedural guidance in Mitraclip procedure von Gavazzoni, M, Zuber, M Z, Miura, M M, Pozzoli, A P, Taramasso, M T, Ho, E C H, Maisano, F M

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Electromigration in thin-film solder joints von Ho, C.E., Yang, C.H., Hsu, L.H.

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Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system von Ho, C.E., Fan, C.W., Hsieh, W.Z.

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Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure von Peng, S.P., Wu, W.H., Ho, C.E., Huang, Y.M.

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Sn–Ag–Cu solder reaction with Au/Pd/Ni(P) and Au/Pd(P)/Ni(P) platings von Ho, C.E., Lin, Y.C., Wang, S.J.

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A procedure for an automated measurement of song similarity von Tchernichovski, Ofer, Nottebohm, Fernando, Ho, Ching Elizabeth, Pesaran, Bijan, Mitra, Partha Pratim

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Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni von HO, C. E, TSAI, R. Y, LIN, Y. L, KAO, C. R

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Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering von Ho, C.E., Fan, C.W., Wu, W.H., Kuo, T.T.

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Effects of limited Cu supply on soldering reactions between SnAgCu and Ni von HO, C. E, LIN, Y. W, YANG, S. C, KAO, C. R, JIANG, D. S

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Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process: Butterfly deposition mode von Ho, C.E., Hsieh, W.Z., Chen, C.C., Lu, M.K.

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Isolation and chromosomal assignment of 100 highly informative human simple sequence repeat polymorphisms von Hudson, Thomas J., Engelstein, Marcy, Lee, Matthias K., Ho, Elizabeth C., Rubenfield, Marc J., Adams, Christopher P., Housman, David E., Dracopoli, Nicholas C.

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Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process von Ho, C.E., Liao, C.W., Pan, C.X., Chen, H.J., Kuo, J.C., Chen, D.

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Field-emission transmission electron microscopy study of the reaction sequence between Sn–Ag–Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging von Ho, C.E., Wang, C.C., Rahman, M.A., Lin, Y.C.

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Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System von Ho, C. E., Hsu, L. H., Lin, S. W., Rahman, M. A.

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Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses von Ho, C. E., Wu, W. H., Hsu, L. H., Lin, C. S.

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The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples von Wu, W.H., Chung, H.L., Chen, C.N., Ho, C.E.

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Facial nerve outcomes in functional vestibular schwannoma surgery: less than total tumour excision significantly improves results von Martin, T P C, Fox, H, Ho, E-C, Holder, R, Walsh, R, Irving, R M

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Further evidence for a locus for cutaneous malignant melanoma-dysplastic nevus (CMM/DN) on chromosome Ip, and evidence for genetic heterogeneity von GOLDSTEIN, A. M, DRACOPOLI, N. C, HO, E. C, FRASER, M. CK, KEARNS, K. S, BALE, S. J, MCBRIDE, O. W, CLARK, W. H, TUCKER, M. A

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The UWO contribution to the NIST aerodynamic database for wind loads on low buildings: Part 1. Archiving format and basic aerodynamic data von Ho, T.C.E., Surry, D., Morrish, D., Kopp, G.A.

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