Theoretical investigation of the displacement ductility capacity of scoured fixed-head piles in cohesive soil von Chiou, Jiunn-Shyang, Ho, Cheng-En

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Critical liquefied soil thickness for response patterns of piles in inclined liquefied ground overlain by nonliquefied crust von Chiou, Jiunn‐Shyang, Hsu, Yuan‐Man, Ho, Cheng‐En

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High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF) von Lee, Pei-Tzu, Chang, Chih-Hao, Lee, Cheng-Yu, Wu, Ying-Syuan, Yang, Cheng-Hsien, Ho, Cheng-En

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Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention von Lee, Pei-Tzu, Lee, Cheng-Yu, Hsieh, Wan-Zhen, Chen, Chih-Tsung, Ho, Cheng-En

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Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 von Lee, Pei-Tzu, Hsieh, Wan-Zhen, Lee, Cheng-Yu, Huang, Yu-Hsuan, Chiang, Ching-Yu, Ku, Ching-Shun, Kao, C.R., Ho, Cheng-En

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Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations von Yang, Cheng-Hsien, Lee, Yu-Wei, Lee, Cheng-Yu, Lee, Pei-Tzu, Ho, Cheng-En

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Enhanced adhesion strength between electroplated Cu and ABF substrate with isothermal annealing treatment von Hsu, Pei-Chia, Chang, Shun-Cheng, Lu, Wen-Xuan, Liu, Hung-Cheng, Ho, Cheng-En

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Significantly improving the etching characteristics of electroplated Cu films through microstructure modification von Lee, Cheng-Yu, Lin, Ping-Chou, Yang, Cheng-Hsien, Ho, Cheng-En

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Depth-dependent self-annealing behavior of electroplated Cu von Chen, Chang-Chih, Yang, Cheng-Hsien, Wu, Ying-Syuan, Ho, Cheng-En

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Current stressing-induced growth of Cu₃Sn in Cu/Sn/Cu solder joints von Chen, Delphic, Ho, Cheng-En, Kuo, Jui-Chao

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Microwave Dielectric Properties of (Mg1−xNix)2TiO4 (x=0.02-0.1) Ceramics von Huang, Cheng-Liang, Ho, Cheng-En

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High-frequency signal transmission in a coplanar waveguide structure with different surface finishes von Chiang, Ying-Chih, Tseng, Hao-Wei, Yu, Chun-Jou, Lee, Cheng-Yu, Huang, Chien-Chang, Ho, Cheng-En

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Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints von Tsai, Kun-Lin, Chen, Chih-Ming, Ho, Cheng-En

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Depletion and phase transformation of a submicron Ni(P) film in the early stage of soldering reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu von Ho, Cheng-En, Hsieh, Wan-Zhen, Yang, Tsung-Hsun

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Electromigration in 3D-IC scale Cu/Sn/Cu solder joints von Ho, Cheng-En, Lee, Pei-Tzu, Chen, Chih-Nan, Yang, Cheng-Hsien

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Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure von Lee, Pei-Tzu, Hsieh, Wan-Zhen, Lee, Cheng-Yu, Tseng, Shao-Chin, Tang, Mau-Tsu, Chiang, Ching-Yu, Kao, C.R., Ho, Cheng-En

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Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures von Yang, Cheng-Hsien, Lee, Yu-Wei, Lee, Cheng-Yu, Chang, Chih-Hao, Ho, Cheng-En

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Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship von Huang, Bau-Chin, Yang, Cheng-Hsien, Lee, Cheng-Yu, Hu, Yu-Lung, Hsu, Chi-Chang, Ho, Cheng-En

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Investigating the P–delta effect on displacement ductility capacity of scoured fixed-head piles in cohesive soil von Ho, Cheng-En, Chiou, Jiunn-Shyang

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Formation mechanism of pinholes in electroplated Cu films and its mitigation von Chen, Chang-Chih, Hsieh, Cheng-Hui, Lee, Yu-Wei, Yang, Cheng-Hsien, Ho, Cheng-En

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