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  1. 1
    Does Advanced Footwear Technology Improve Track and Road Racing Performance? An Explorative Analysis Based on the 100 Best Yearly Performances in the World Between 2010 and 2022

    Does Advanced Footwear Technology Improve Track and Road Racing Performance? An Explorative Analysis Based on the 100 Best Yearly Performances in the World Between 2010 and 2022 von Willwacher, Steffen, Mai, Patrick, Helwig, Janina, Hipper, Markus, Utku, Burkay, Robbin, Johanna

    Veröffentlicht in Sports medicine - open

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  2. 2
    The effect of fresh and used ankle taping on lower limb biomechanics in sports specific movements

    The effect of fresh and used ankle taping on lower limb biomechanics in sports specific movements von Utku, Burkay, Bähr, Gloria, Knoke, Hannah, Mai, Patrick, Paganini, Francesca, Hipper, Markus, Braun, Luca, Denis, Yannick, Helwig, Janina, Willwacher, Steffen


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  3. 3
    Managing lower extremity loading in distance running by altering sagittal plane trunk leaning

    Managing lower extremity loading in distance running by altering sagittal plane trunk leaning von Braun, Luca, Mai, Patrick, Hipper, Markus, Denis, Yannick, Helwig, Janina, Anedda, Bastian, Utku, Burkay, Gehring, Dominic, Willwacher, Steffen


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  4. 4
    Additional file 1 of Does Advanced Footwear Technology Improve Track and Road Racing Performance? An Explorative Analysis Based on the 100 Best Yearly Performances in the World Between 2010 and 2022

    Additional file 1 of Does Advanced Footwear Technology Improve Track and Road Racing Performance? An Explorative Analysis Based on the 100 Best Yearly Performances in the World Bet... von Willwacher, Steffen, Mai, Patrick, Helwig, Janina, Hipper, Markus, Utku, Burkay, Robbin, Johanna

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  5. 5
    HANDLING THIN WAFER DURING CHIP MANUFACTURE

    HANDLING THIN WAFER DURING CHIP MANUFACTURE von Killer, Thomas, Maier, Gabriel, Mueller-Hipper, Andreas, Brunnbauer, Markus, Janker, Marina, Thoms, Christine, Koller, Adolf, Stueckjuergen, Andreas

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  6. 6
    Handling thin wafer during chip manufacture

    Handling thin wafer during chip manufacture von MARKUS BRUNNBAUER, ADOLF KOLLER, MARINA JANKER, THOMAS KILLER, ANDREAS MUELLER-HIPPER, GABRIEL MAIER, ANDREAS STUECKJUERGEN, CHRISTINE THOMS

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  7. 7
    Handhaben eines dünnen Wafers während der Chipherstellung

    Handhaben eines dünnen Wafers während der Chipherstellung von Killer, Thomas, Maier, Gabriel, Mueller-Hipper, Andreas, Brunnbauer, Markus, Janker, Marina, Thoms, Christine, Koller, Adolf, Stueckjuergen, Andreas

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