Optimization of Intermediate Annealing Treatment Duration for ABS Resin Plating Using UV Irradiation as A Pre-Treatment von DEVRUKHKAR, Ajay, TASHIRO, Katsuhiko, UMEDA, Yasushi, HONMA, Hideo, MOCHIZUKI, Toshikatsu, Joo-Hyong NOH

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Tailored cell sheet engineering using microstereolithography and electrochemical cell transfer von Kobayashi, Yuka, Cordonier, Christopher E. J., Noda, Yohei, Nagase, Fuminori, Enomoto, Junko, Kageyama, Tatsuto, Honma, Hideo, Maruo, Shoji, Fukuda, Junji

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Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer von Okabe, Kyohei, Kagami, Takahiro, Horiuchi, Yoshio, Takai, Osamu, Honma, Hideo, Cordonier, Christopher E. J.

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Influence of SPS Decomposition Product 1,3-Propane Disulfonic Acid on Electrolytic Copper Via Filling Performance von Kimizuka, Ryoichi, Toda, Hisayuki, Eda, Tetsuro, Kishimoto, Kazuki, Oh, Reisei, Honma, Hideo, Takai, Osamu

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Design and Fabrication of a Graphene/Polyvinylidene Fluoride Nanocomposite-Based Airflow Sensor von Maharjan, Surendra, Samoei, Victor K, Amili, Omid, Sano, Keiichiro, Honma, Hideo, Jayatissa, Ahalapitiya H

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Electroless Plating Catalyst Performance of a Cationic Moiety Bearing Palladium Complex von Kohtoku, Makoto, Honma, Hideo, Takai, Osamu

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Formation of Micrometer Scale Metal Structures on Glass by Selective Electroless Plating on Photopatterned Titanium and Copper Containing Films von Cordonier, Christopher E. J, Okabe, Kyohei, Horiuchi, Yoshio, Nakamura, Akimasa, Ishikawa, Kaoru, Seino, Shozo, Takagi, Shinsuke, Honma, Hideo

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Electroless Plating of Insulating Resins by Atmospheric UV Treatment von HORIUCHI, Yoshio, HONMA, Hideo

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Optical properties and durability performance of substance SiO2/Nb2O5 for multilayer thin films prepared by high-density plasma-assisted vapor deposition von Moriizumi, Yasushi, Honma, Hideo, Takai, Osamu

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Selective Plating on Photopatterned Titanium Oxide Films von Cordonier, Christopher E. J., Endo, Hitoshi, Kagami, Takahiro, Okabe, Yohei, Ide, Mieko, Suzuki, Shion, Honma, Hideo

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Direct Gold Plating Selectively on UV Modified Polymer Film Using Tiopronin-Gold von Endo, Hitoshi, Tashiro, Katsuhiko, Ma, Hengyi, Mizuhashi, Shoei, Yamamoto, Taibo, Kimizuka, Ryoichi, Takai, Osamu, Honma, Hideo, Cordonier, Christopher E. J.

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Plating technology for electronics packaging von Honma, Hideo

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Alloying Property of a Conductive Filler to Resolve the Re-melting Issue von SUGIMOTO, Kaoru, YAGI, Tomohisa, HONMA, Hideo, WATANABE, Mitsuhiro

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Bonding Condition Evaluation using a Melting-Point-Change Type Conductive Paste von SUGIMOTO, Kaoru, YAGI, Tomohisa, HONMA, Hideo, WATANABE, Mitsuhiro

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Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode von HORIUCHI, Yoshio, SUZUKI, Yohei, NOH, Joo-hyong, HONMA, Hideo, TAKAI, Osamu, CORDONIER, Christopher E. J.

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Inhibitory Effect of Sulfur–containing Compounds on Anodic Oxidation of Borohydride von MIZUHASHI, Shoei, CORDONIER, Christopher E. J., SATO, Yusuke, HONMA, Hideo, TAKAI, Osamu

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Hydrophilization of PP Resin and ABS Resin by Applying Electrolyzed Sulfuric Acid von Umeda, Yasushi, Nakabayashi, Yuki, Nagai, Tatsuo, Tashiro, Katsuhiko, Honma, Hideo, Sakamoto, Yukihiro

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Cu patterning on Si substrate using solution-processed Ti-Cu oxide films and electroless plating von Miyazeki, Yusuke, Horiuchi, Yoshio, Noh, Joo-Hyong, Cordonier, Christopher E. J., Honma, Hideo, Arakawa, Taro

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Surface Metallization on High Temperature Liquid-Crystal-Polymer Film by UV-Irradiation Process von Sugiyama, Takeharu, Iimori, Yosuke, Baba, Kunihiro, Watanabe, Mitsuhiro, Honma, Hideo

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High Adhesion Plating on Smooth Resin Surfaces Using a High-power UV Lamp von Oshikiri, Junki, Kosuge, Atushi, Iimori, Yousuke, Watanabe, Mituhiro, Honma, Hideo, Takai, Osamu

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