Design and Analysis of Novel Micromachined Thermocouples with Vertical Free-Standing High-Aspect-Ratio Geometry von Wick, M., Hedler, H., Seidel, H.

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Enhancement of MEMS-based Ga 2 O 3 Gas Sensors by Surface Modifications von Pohle, R., Weisbrod, E., Hedler, H.

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Fabrication of high aspect ratio microtube arrays for 2D photonic crystals von Kraeh, C, Popsecu, A, Schieber, M, Hedler, H, Bieniek, T, Wielgoszewski, G, Mocza a, M, Finley, J

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In situ synthesis of VO 2 for tunable mid-infrared photonic devices von Martinez Hurtado, J. L., Kraeh, C., Popescu, A., Hedler, H., Finley, J. J.

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synthesis of VO for tunable mid-infrared photonic devices von Martinez Hurtado, J. L, Kraeh, C, Popescu, A, Hedler, H, Finley, J. J

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In situ synthesis of VO sub(2) for tunable mid-infrared photonic devices von Martinez Hurtado, JL, Kraeh, C, Popescu, A, Hedler, H, Finley, J J

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Incorporation of Sb in Si during CW-laser stimulated solid phase epitaxy von Hedler, H., Götz, G.

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An embedded device technology based on a molded reconfigured wafer von Brunnbauer, M., Furgut, E., Beer, G., Meyer, T., Hedler, H., Belonio, J., Nomura, E., Kiuchi, K., Kobayashi, K.

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Photonic crystal materials realized by high aspect ratio micro-rod arrays von Kraeh, C., Schieber, M., Popescu, A., Hedler, H., Finley, J.

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Activation of High As and Sb Concentrations in Silicon by Laser Irradiation von Hedler, H., Andrä, W., Götz, G.

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High performance 3D interconnects based on electrochemical etch and liquid metal fill von Hedler, H, Scheiter, T, Schieber, M, Klumpp, A, Ramm, P

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Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging von Dudek, R., Walter, H., Doering, R., Michel, B., Meyer, T., Zapf, J., Hedler, H.

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Semiconductor module and method for mfg. semiconductor module von G. FRANKFSKOKI,H. HEDLER,B. WASKES

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Semiconductor module and method for mfg. semiconductor module von B. WASKES, H. HEDLER, G. FRANKFSKOKI

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Thermomechanical design for reliability of WLPs with compliant interconnects von Dudek, R., Walter, H., Doering, R., Michel, B., Meyer, T., Zapf, J., Hedler, H.

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Multichip packaging in QFPs by PBO-multilayer high density interconnect von Ammann, N., Helder, H.

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Incorporation of Sb in Si during CW-laser stimulated solid phase epitaxy von Hedler, H., Götz, G.

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Activation of High As and Sb Concentrations in Silicon by Laser Irradiation von Hedler, H., Andrä, W., Götz, G.

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Fumonisins B1 + B2 change the expression of genes in apoptosis balance in Nile tilapia fingerlings von Claudino-Silva, Stefânia C., Lala, Bruno, Mora, Natália H.A.P., Schamber, Christiano R., Nascimento, Carlos S., Pereira, Vinícius V., Hedler, Dayne L., Gasparino, Eliane

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Heterotrimerization of P II ‐like signalling proteins: implications for P II ‐mediated signal transduction systems von Forchhammer, Karl, Hedler, Andrea, Strobel, Heike, Weiss, Verena

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