Hydration of polysaccharide hyaluronan observed by IR spectrometry. I. Preliminary experiments and band assignments von Haxaire, K., Maréchal, Y., Milas, M., Rinaudo, M.

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Hydration of hyaluronan polysaccharide observed by IR spectrometry. II. Definition and quantitative analysis of elementary hydration spectra and water uptake von Haxaire, K., Maréchal, Y., Milas, M., Rinaudo, M.

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Microstructure and texture analysis of narrow copper line versus widths and annealing for reliability improvement von Galand, R., Haxaire, K., Arnaud, L., Petitprez, E., Clement, L., Waltz, P., Wouters, Y.

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Conformational behavior of hyaluronan in relation to its physical properties as probed by molecular modeling von Haxaire, K, Braccini, I, Milas, M, Rinaudo, M, Pérez, S

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New generation of Self Ionized Plasma copper seed for sub 40 nm nodes von Guillan, J., Haxaire, K., Chhun, S., Richard, E., Luche, M.C., Arnaud, L., Petitprez, E., Monget, C., Galpin, D., Normandon, P.

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Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances von Dubreuil, O., Caubet-Hilloutou, V., Guillan, J., Haxaire, K., Mellier, M., Caubet, P., Vannier, P., Petitprez, E., Bellet, D., Normandon, Ph

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Characterization and impact of reduced copper plating overburden on 45nm interconnect performances von Dubreuil, O., Caubet-Hilloutou, V., Guillan, J., Haxaire, K., Mellier, M., Caubet, P., Vannier, P., Petitprez, E., Bellet, D., Normandon, Ph

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Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology von Fayolle, M, Torres, J, Passemard, G, Fusalba, F, Fanget, G, Louis, D, Assous, M, Louveau, O, Rivoire, M, Haxaire, K, Mourier, M, Maitrejean, S, Besson, P, Broussous, L, Arnaud, L, Feldis, H

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New generation of Self Ionized Plasma copper seed for sub 40nm nodes von Guillan, J., Haxaire, K., Chhun, S., Richard, E., Luche, M.C., Arnaud, L., Petitprez, E., Monget, C., Galpin, D., Normandon, P.

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Hydration of hyaluronan polysaccharide observed by IR spectrometry. II: Definition and quantitative analysis of elementary hydration specra and water uptake von Haxaire, K., Marechal, Y., Milas, M., Rinaudo, M.

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Process optimisation and dual damascene integration of porous CVD SiOC dielectric at 2.4 and 2.2 k-values for 45 nm CMOS technology von Arnal, V., Hoofman, R.J.O.M., Assous, M., Bancken, P.H.L., Brokaart, M., Brun, P., Casanova, N., Chapelon, L.L., Chevolleau, T., Cowache, C., Daamen, R., Farcy, A., Fayolle, M., Feldis, H., Furukawa, Y., Goldberg, C., Gosset, L.G., Guedj, C., Haxaire, K., Hinsinger, O., Josse, E., Jullian, S., Louveau, O., Michelon, J., Posseme, N., Rivoire, M., Roman, A., Vandeweyer, T., Verheijden, J.A.M., Torres, J.

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3D integration demonstration of a wireless product with design partitioning von Druais, G., Ancey, P., Aumont, C., Caubet, V., Chapelon, L-L, Chaton, C., Cheramy, S., Cordova, S., Cirot, E., Colonna, J-P, Coudrain, P., Divel, T., Dodo, Y., Farcy, A., Guitard, N., Haxaire, K., Hotellier, N., Leverd, F., Liou, R., Michailos, J., Ostrovsky, A., Petitdidier, S., Pruvost, J., Riquet, D., Robin, O., Saugier, E., Sillon, N.

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Application of a Thermo-hydro-mechanical Model for Freezing and Thawing von Haxaire, Aukenthaler, M., Brinkgreve, R.B.J.

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