High-performance interconnects: an integration overview von Havemann, R.H., Hutchby, J.A.

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Air-gap formation during IMD deposition to lower interconnect capacitance von Shieh, B., Saraswat, K.C., McVittie, J.P., List, S., Nag, S., Islamraja, M., Havemann, R.H.

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Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals von JIANG, Qing-Tang, NOWELL, Matt, FORAN, Brendan, FRANK, Aaron, HAVEMANN, R. H, PARIHAR, Vijay, AUGUR, R. A, LUTTMER, J. D

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Integrated CVD–PVD Al plug processing for sub-half micron features von Konecni, A, Dixit, G, Russell, N.M, Luttmer, J.D, Havemann, R.H

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A novel process for fabricating conformal and stable TiN-based barrier films von LU, J. P, HSU, W. Y, HONG, Q. Z, DIXIT, G. A, LUTTMER, J. D, HAVEMANN, R. H, MAGEL, L. K

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Effect of Ar sputter etch on the texture of Ti and Al/TiN/Ti metal stack von HSU, W.-Y, HONG, Q.-Z, LIU, H.-Y, DOUGLAS, M, TAYLOR, K, MAGEL, L. K, LUTTMER, J. D, HAVEMANN, R. H

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Thermal stability of Al/barrier/TiSix multilayer structures von LU, J. P, HSU, W. Y, HONG, Q. Z, DIXIT, G. A, LUTTMER, J. D, HAVEMANN, R. H, CHEN, P. J, TSAI, H. L, MAGEL, L. K

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Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects von Ogawa, E.T., Lee, K.-D., Matsuhashi, H., Ko, K.-S., Justison, P.R., Ramamurthi, A.N., Bierwag, A.J., Ho, P.S., Blaschke, V.A., Havemann, R.H.

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Reliability and early failure in Cu/oxide dual-damascene interconnects von OGAWA, Ennis T, LEE, Ki-Don, MATSUHASHI, Hideki, HO, Paul S, BLASCHKE, Volker A, HAVEMANN, Robert H

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An 8-ns 256K ECL SRAM with CMOS memory array and battery backup capability von Tran, H.V., Scott, D.B., Fung, P.K., Havemann, R.H., Eklund, R.H., Ham, T.E., Haken, R.A., Shah, A.H.

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Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization von Chen, Yu-Pei, Dixit, Girish A, Lu, Jiong-Ping, Hsu, Wei-Yung, Konecni, Anthony J, Luttmer, J.D, Havemann, Robert H

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Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects von Ogawa, Ennis T., Bierwag, Alexander J., Lee, Ki-Don, Matsuhashi, Hideki, Justison, Patrick R., Ramamurthi, Anup N., Ho, Paul S., Blaschke, Volker A., Griffiths, David, Nelsen, Anne, Breen, Mark, Havemann, Robert H.

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Ti-based Barrier for Cu Interconnect Applications von Wu, W., Wu, H.-J., Dixit, G., Shaviv, R., Gao, M., Mountsier, T., Harm, G., Dulkin, A., Fuchigami, N., Kailasam, S. K., Klawuhn, E., Havemann, R. H.

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Texture-induced asymmetric reactions in TiN/Al–Cu/TiN von Hong, Q. Z., Jeng, S. P., Havemann, R. H., Tsai, H. L., Liu, H. Y.

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Thermal stability of Al/barrier/TiSi sub(x) multilayer structures von Lu, J P, Hsu, W Y, Hong, Q Z, Dixit, G A, Luttmer, J D, Havemann, R H, Chen, P J, Tsai, H L, Magel, L K

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Annealing impact on damascene Cu resistivity and microstructures von Qing-Tang Jiang, Ming-Hsing Tsai, Frank, A., Parihar, V., Nowell, M., Augur, R.A., Havemann, R.H., Luttmer, J.D.

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Nonlinear correction to Ohm's law derived from Boltzmann's equation von Havemann, R. H., Engel, P. F., Baird, J. R.

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Conductivity and the Microwave Properties of 81-Permalloy Thin Films (Correspondence) von Havemann, R.H., Davis, L.E.

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Implication And Solutions For Joule Heating In High Performance Interconnects Incorporating Low-k Dielectrics von Shih, Chang, Havemann, Levine

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Line width dependence of copper resistivity von Qing-Tang Jiang, Ming-Hsing Tsai, Havemann, R.H.

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