Leading with Conviction: Mastering the Nine Critical Pillars of Integrated Leadership von Saar, Shalom Saada, Hargrove, Michael J

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Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin von Xie, Yutong, Davaji, Benyamin, Chakarov, Ivan, Wen, Sandy, Hargrove, Michael, Fried, David, Doerschuk, Peter C., Lal, Amit

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Accurate Simulation of Transistor-Level Variability for the Purposes of TCAD-Based Device-Technology Cooptimization von Gerrer, Louis, Brown, Andrew R., Millar, Campbell, Hussin, Razaidi, Amoroso, Salvatore Maria, Binjie Cheng, Reid, Dave, Alexander, Craig, Fried, David, Hargrove, Michael, Greiner, Ken, Asenov, Asen

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Book Highlight-The Pillar of Collaboration von Saar, Shalom Saada, Hargrove, Michael J.

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Leading with conviction: mastering the nine critical pillars of integrated leadership von Saar, Shalom Saada, Hargrove, Michael J

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RF potential of a 0.18-μm CMOS logic device technology von Burghartz, J.N., Hargrove, M., Webster, C.S., Groves, R.A., Keene, M., Jenkins, K.A., Logan, R., Nowak, E.

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APPARATUS AND METHOD FOR MANUFACTURING A COMPOSITE PART TO PROVIDE SMOOTH JOIN SURFACES OF THE COMPOSITE PART von Heath, Richard E, Hargrove, Michael C, Branton, Jennifer F

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APPARATUS AND METHOD FOR MANUFACTURING A COMPOSITE PART TO PROVIDE SMOOTH JOIN SURFACES OF THE COMPOSITE PART von BRANTON, Jennifer F, HEATH, Richard E, HARGROVE, Michael C

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Combined C-V/I-V front-end-of-line measurement von Polonsky, S., Realov, S., Jiun-Hsin Liao, Hargrove, M., Ketchen, M.

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SEMICONDUCTOR DEVICE WITH ISOLATION TRENCH LINER, AND RELATED FABRICATION METHODS von CARTER, Richard, KLUTH, George, HARGROVE, Michael

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Composite component manufacturing method and composite component manufacturing apparatus von BRANTON, JENNIFER, F, HEATH, RICHARD, E, HARGROVE, MICHAEL, C

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Method to fabricate completely isolated silicon regions von Hargrove, Michael

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Method to fabricate completely isolated silicon regions von HARGROVE MICHAEL

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Integrated circuits having FinFET semiconductor devices and methods of fabricating the same to resist sub-fin current leakage von Gruensfelder Christian, Liu Yanxiang, Hargrove Michael

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METHODS AND APPARATUSES FOR FORMING COMPOSITE PARTS FROM MULTI-PLY PREPREG COMPOSITE CHARGES von Anderson, Eric C, Heath, Richard E, Martin, Dorekia, Hargrove, Michael C, Handolescu, Caleb J, Prause, Richard Alexander, Modin, Andrew E, Register, Justin H

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METHODS AND APPARATUSES FOR FORMING COMPOSITE PARTS FROM MULTI-PLY PREPREG COMPOSITE CHARGES von ANDERSON, Eric C, PRAUSE, Richard Alexander, MARTIN, Dorekia, HEATH, Richard E, HANDOLESCU, Caleb J, HARGROVE, Michael C, MODIN, Andrew E, REGISTER, Justin H

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Low-voltage transient bipolar effect induced by dynamic floating-body charging in scaled PD/SOI MOSFETs von Pelella, M.M., Fossum, J.G., Dongwook Suh, Krishnan, S., Jenkins, K.A., Hargrove, M.J.

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Methods of forming a non-planar ultra-thin body semiconductor device and the resulting devices von JACOB AJEY POOVANNUMMOOTTIL, HARGROVE MICHAEL, XIE RUILONG

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ETSOI CMOS ARCHITECTURE WITH DUAL BACKSIDE STRESSORS von HARGROVE MICHAEL, YANG BIN

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METHOD FOR FORMING SEPARATION REGION IN SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING SILICON ON INSULATOR INTEGRATED CIRCUIT von HARGROVE MICHAEL

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