Treffer 1 - 2 von 2 für Suche 'HangChul Choi', Suchdauer: 0,23s Treffer weiter einschränken
  1. 1
    Thermally enhanced and thin profile flip chip packages for Tablet processor applications

    Thermally enhanced and thin profile flip chip packages for Tablet processor applications von Eslampour, Hamid, Joshi, Mukul, KyungOe Kim, Sun Wei, JaeHan Chung, TaeWoo Lee, HangChul Choi, Emigh, Roger


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  2. 2
    Mixed Pitch BGA (mpBGA) packaging development for high bandwidth-high speed networking devices

    Mixed Pitch BGA (mpBGA) packaging development for high bandwidth-high speed networking devices von Savic, J., Nagar, M., Weidong Xie, Ahmad, M., Senk, D., Bansal, A., Islam, N., Park Gun Oh, Pendse, R., Choi HangChul, Lee SangHo


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