Electrodeposition of Ni from Low-Temperature Sulfamate Electrolytes von Kelly, J. J., Goods, S. H., Talin, A. A., Hachman, J. T.

Volltext

Nucleation and Adhesion of Electrodeposited Copper on Anodized Thin-Film Aluminum for LIGA Microfabrication von Losey, M W, Griffiths, S K, Hachman, J T

Volltext

Resist substrate studies for LIGA microfabrication with application to a new anodized aluminum substrate von Griffiths, S K, Losey, M W, Hachman, J T, Skala, D M, Hunter, L L, Yang, N Y C, Boehme, D R, Korellis, J S, Aigeldinger, G, Lu, W Y, Kelly, J J, Hekmaty, M A, McLean, D E, Yang, P C Y, Hauck, C A, Friedmann, T A

Volltext

Influence of mask substrate materials on resist sidewall roughness in deep X-ray lithography von Aigeldinger, G., Yang, C.-Y. P., Skala, D. M., Morse, D. H., Talin, A. A., Griffiths, S. K., Hachman, J. T., Ceremuga, J. T.

Volltext

Precision manufacturing using LIGA (abstract) von Jackson, Keith H., Malek, Chantal Khan, Bonivert, William D., Hruby, J. M., Hachman, J. T., Brennen, Reid A., Wiberg, Dean, Hecht, Michael H.

Volltext

Apparatus and method for controlling plating uniformity von KELLY JAMES J, WEST ALAN C, HACHMAN, JR. JOHN T

Volltext bestellen

Experimental study of the microstructure and stress of electroplated gold for microsystem applications von KELLY, J. J, YANG, N, HEADLEY, T, HACHMAN, J

Volltext

High aspect ratio patterning with a proximity ultraviolet source von Dentinger, Paul M., Krafcik, Karen L., Simison, Kelby L., Janek, Richard P., Hachman, John

Volltext

Microscreen-based replication of electroforming micromolds von DOMEIER, L. A, GONZALES, M, HACHMAN, J, HRUBY, J. M, JANEK, R, MORALES, A. M

Volltext

Apparatus and method for controlling plating uniformity von Hachman, Jr., John T, Kelly, James J, West, Alan C

Volltext bestellen

Apparatus and method for controlling plating uniformity von KELLY JAMES J, WEST ALAN C, HACHMAN JOHN T

Volltext bestellen