Measurement of effective cure shrinkage of epoxy‐based molding compound by fiber Bragg grating sensor using two‐stage curing process von Kim, Changsu, Phansalkar, Sukrut Prashant, Lee, Hyun‐Seop, Han, Bongtae

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Results After Total Hip Arthroplasty With a Large Head and Bipolar Arthroplasty in Patients With Displaced Femoral Neck Fractures von Cho, Myung-Rae, MD, Lee, Hyun-Seop, MD, Lee, Sang-Wook, MD, Choi, Chang-Hyuk, MD, Kim, Shin-Kun, MD, Ko, Sang-Bong, MD

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Coagulation kinetics of round-sided disk particles under simple shear flow von Lee, Hyun Seop, Kim, Chong Youp

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Study on binary collision of rod-like particles under simple shear flow von Lee, Hyun Seop, Kim, Chong Youp

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Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure von Lee, Hyun Seop, Sun, Yong, Kim, Changsu, Han, Bongtae

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Hybrid CMP Slurry Supply System Using Ionization and Atomization von Jo, Hoseong, Lee, Da Sol, Jeong, Seon Ho, Lee, Hyun Seop, Jeong, Hae Do

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Signal analysis of CMP process based on AE monitoring system von Park, Sun-Joon, Lee, Hyun-Seop, Jeong, Haedo

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Comprehensive Viscoelastic Properties Characterization of EMC Using FBG Sensor von Sun, Yong, Lee, Hyun-Seop, Han, Bongtae

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Adaptive Parallel Decomposition for Multidisciplinary Design von Park, Hyung-wook, Lee, Se J, Lee, Hyun-seop, Choi, Dong-hoon

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Effect of Citric Acid in Chemical Mechanical Polishing (CMP) for Lithium Tantalate (LiTaO3) Wafer von Lee, Hyun Seop

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Material Removal Model of Lap Grinding for Sapphire Substrate Based on Roughness Parameters von Lee, Hyun Seop, Lee, Taek Yung

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Comparison of Bipolar Hemiarthroplasty and Total Hip Arthroplasty using Large Heads in Patients with Femoral Neck Fractures von Cho, Myung-Rae, Lee, Jae-Kun, Lee, Hyun-Seop

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Research on CMP Characteristics Attribute to Groove Size von Guo, Yong Chang, Lee, Young Kyun, Lee, Hyun Seop, Jeong, Hae Do

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Materialization of strained CVD-graphene using thermal mismatch von Lee, Seung-Mo, Kim, Sang-Min, Na, Min Young, Chang, Hye Jung, Kim, Kwang-Seop, Yu, Hyunung, Lee, Hak-Joo, Kim, Jae-Hyun

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The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection von Cho, Han Chul, Kim, Young Min, Lee, Hyun Seop, Jeong, Hae Do, Joo, Suk Bae

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Pad profile measurement system integrated with swing arm von LEE HYUN SEOP

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CMP High-efficient hybrid polishing system using hydroxyl radical and dissolved oxygen von LEE HYUN SEOP

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CMP SiC GaN High-efficient hybrid polishing system using dispersion improvement of the abrasive grain von LEE HYUN SEOP

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AIRBAG DEVICE FOR VEHICLE von YOO, Wan Dong, LEE, Hyun Seop, JUNG, Dae Chang, GWON, Tae Ik, OH, Nan Young

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The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate von Jeong, Suk Hoon, Lee, Hyun Seop, Joo, Suk Bae, Park, Boum Young, Seo, Heon Deok, Jeong, Hae Do, Lee, Ho Jun, Kim, Hyoung Jae

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