A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate von Kuo, Hung-Chun, Kuo, Chih-Wen, Wang, Chen-Chao, Hung, Chih-Pin

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Microstructural effects of copper deposits on direct bonding for 3D IC integration von Xie, Zong-Yu, Huang, Po-Kai, Lu, Yin-Chi, Kao, Golden, Hung, Chih-Pin, Yasuda, Kiyokazu, Song, Jenn-Ming

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Dielectric Characterization of Ultra-Thin Low-Loss Build-Up Substrate for System-in-Package (SiP) Modules von Ho, Cheng-Yu, Cheng, Hung-Hsiang, Pan, Po-Chih, Wang, Chen-Chao, Hung, Chih-Pin

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Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints von Song, Jenn-Ming, Huang, Bo-Chang, Tarng, David, Hung, Chih-Pin, Yasuda, Kiyokazu

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Light enhanced direct Cu bonding for advanced electronic assembly von Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin

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Enhanced Cu-to-Cu direct bonding by controlling surface physical properties von Chiang, Po-Hao, Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Hung, Chih-Pin

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Very Compact Stacked LC Resonator-Based Bandpass Filters With a Novel Approach to Tune the Transmission Zeros von CHEN, Chien-Hsun, HUANG, Chien-Hsiang, HOMG, Tzyy-Sheng, WU, Sung-Mao, LI, Jian-Yu, CHEN, Cheng-Chung, CHIU, Chi-Tsung, HUNG, Chih-Pin

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A Novel Channel Characteristics Estimation Methodology for High-Speed SerDes Interface on Flip-Chip Ball Grid Array Packages von Ho, Cheng-Yu, Cheng, Hung-Hsiang, Pan, Po-Chih, Wang, Chen-Chao, Hung, Chih-Pin

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Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging von Song, Jenn-Ming, Liang, Sin-Yong, Xie, Zong-Yu, Chiang, Po-Hao, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin, Lin, Jing-Yuan

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Optimum Design of Transformer-Type Marchand Balun Using Scalable Integrated Passive Device Technology von HUANG, Chien-Hsiang, HORNG, Tzyy-Sheng, WANG, Chen-Chao, CHIU, Chi-Tsung, HUNG, Chih-Pin

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Effect of flip-chip ball grid array structure on capillary underfill flow von Hung, Hao-Hsi, Cheng, Yu-Chi, Hwang, Sheng-Jye, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Chen, Dao-Long, Wang, Chen-Chao, Hung, Chih-Pin

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Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond von Fu-Yi Han, Kung-Chung Lu, Tzyy-Sheng Horng, Jenshan Lin, Hung-Hsiang Cheng, Chi-Tsung Chiu, Chih-Pin Hung

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Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs von Horng, Tzyy-Sheng, Wu, Sung-Mao, Huang, Hui-Hsiang, Chiu, Chi-Tsung, Hung, Chih-Pin

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Very compact transformer-coupled balun-integrated bandpass filter using integrated passive device technology on glass substrate von Chien-Hsun Chen, Chien-Hsiang Huang, Tzyy-Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, Chih-Pin Hung, Jian-Yu Li, Cheng-Chung Chen

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TSV technology for 2.5D IC solution von Meng-Jen Wang, Chang-Ying Hung, Chin-Li Kao, Pao-Nan Lee, Chi-Han Chen, Chih-Pin Hung, Ho-Ming Tong

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Analysis of flip-chip ball grid array underfill flow process von Hung, Hao-Hsi, Cheng, Yu-Chi, Hwang, Sheng-Jye, Chen, Dao-Long, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Wang, Chen-Chao, Hung, Chih-Pin

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A Novel Time-Domain Approach for Extracting Broadband Models of Power Delivery NetworksWith Resonance Effect von WANG, Chen-Chao, KUO, Chih-Wen, WU, Sung-Mao, CHENG, Hung-Hsiang, CHIU, Chi-Tsung, HUNG, Chih-Pin

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Accurate numerical simulations of capillary underfill process for flip-chip packages von Cheng, Yu-Chi, Chen, Yu-Hsien, Hung, Hao-Hsi, Hwang, Sheng-Jye, Chen, Dao-Long, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Wang, Chen-Chao, Hung, Chih-Pin

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High bandwidth application with Wide I/O memory on 2.5D-IC silicon interposer von Chen-Chao Wang, Hung-Hsiang Cheng, Ming-Feng Chung, Po-Chih Pan, Chi-Tsung Chiu, Chih-Pin Hung

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Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric Superstrate von Yung-Shou Cheng, Wei-Da Guo, Chih-Pin Hung, Ruey-Beei Wu, De Zutter, Daniël

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