Application of the LCPT model to solid-liquid equilibria for binary compound-forming alloys von Howell, Wayne J., Alger, Montgomery M., Eckert, Charles A.

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Chemical-physical model for the interfacial thermodynamics of liquid metal solutions von Howell, Wayne J, Eckert, Charles A

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Solution thermodynamics for liquid metals von Howell, Wayne J, Eckert, Charles A

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Solid-liquid equilibria in the systems thianthrene + phenanthrene, salicyclic acid + phenanthrene, and 3-hydroxybenzoic acid + phenanthrene von Mayer, Michael M, Howell, Wayne J, Tomasko, David L, Eckert, Charles A

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Development of the AVEC model for associating mixtures using NMR spectroscopy von Karachewski, Anne M., Howell, Wayne J., Eckert, Charles A.

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ULTRA-FINE CONTACT ALIGNMENT von FERENCE THOMAS G, HOWELL WAYNE J

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ULTRA-FINE CONTACT ALIGNMENT von FERENCE THOMAS G, HOWELL WAYNE J

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A linear chemical-physical theory model for liquid metal solution thermodynamics von Howell, Wayne J., Lira, Carl T., Eckert, Charles A.

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An improved mosced equation for the prediction and application of infinite dilution activity coefficients von Howell, Wayne J., Karachewski, Anna M., Stephenson, Kevin M., Eckert, Charles A., Park, Jung Hag, Carr, Peter W., Rutan, Sarah C.

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Solid-liquid equilibria in the systems thianthrene + phenanthrene, salicylic acid + phenanthrene, and 3-hydroxybenzoic acid + phenanthrene von MAYER, M. M, HOWELL, W. J, TOMASKO, D. L, ECKERT, C. A

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Ultra-fine contact alignment von FERENCE THOMAS G, HOWELL WAYNE J

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SEMICONDUCTOR STRUCTURE AND MANUFACTURE THEREOF von WAYNE J HOWELL, FERENCE THOMAS G

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Metallization structure for altering connections von BERLIN, CLAUDE L, HOWELL, WAYNE J

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Copper pad structure von MOTSIFF WILLIAM T, HOWELL WAYNE J, MENDELSON RONALD L

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Copper pad structure von Howell, Wayne J, Mendelson, Ronald L, Motsiff, William T

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Carbothermic Reduction Using Liquid Metal Solvents von Howell, Wayne J., Eckert, Charles A., Anderson, Robert N.

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Ultra fine probe contacts von HOWELL, WAYNE J, FERENCE, THOMAS G

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Copper pad structure von MOTSIFF, WILLIAM T, MENDELSON, RONALD L, HOWELL, WAYNE J

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Copper pad structure von MOTSIFF WILLIAM T, HOWELL WAYNE J, MENDELSON RONALD L

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Dual chip with heat sink von SPROGIS EDMUND J, FERENCE THOMAS G, HOWELL WAYNE J

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