A new high-density plasma etching system using a dipole-ring magnet von SEKINE, M, NARITA, M, HORIOKA, K, YOSHIDA, Y, OKANO, H

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Resist and sidewall film removal after Al reactive ion etching (RIE) employing F+H2O downstream ashing von JIMBO, S, SHIMOMURA, K, OHIWA, T, SEKINE, M, MORI, H, HORIOKA, K, OKANO, H

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Highly selective etching of polycrystalline silicon on silicon dioxide at low wafer temperature, employing magnetron plasma von SEKINE, M, HORIOKA, K, ARIKADO, T, OKANO, H

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Single silicon etching profile simulation von ARIKADO, T, HORIOKA, K, SEKINE, M, OKANO, H, HORIIKE, Y

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Resist and Sidewall Film Removal after Al Reactive Ion Etching (RIE) Employing F+H 2 O Downstream Ashing von Jimbo, Sadayuki, Shimomura, Kouji, Ohiwa, Tokuhisa, Sekine, Makoto, Mori, Haruki, Keiji Horioka, Keiji Horioka, Haruo Okano, Haruo Okano

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SIO2 TAPERED ETCHING EMPLOYING MAGNETRON DISCHARGE OF FLUOROCARBON GAS von OHIWA, T, HORIOKA, K, ARIKADO, T, HASEGAWA, OKANO, H

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Gate oxide breakdown phenomena in magnetron plasma von SEKINE, M, HORIOKA, K, YOSHIDA, Y, OKANO, H

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INFLUENCE OF AL SURFACE MODIFICATION ON SELECTIVITY IN VIA-HOLE ETCHING EMPLOYING CHF3 PLASMA von OHIWA, T, ARIKADO, T, HORIOKA, K, HASEGAWA, MATSUSHITA, T, SHIMOMURA, K, OKANO, H

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APPARATUS FOR PRODUCING CARBON FIBER von HORIOKA KEIJI

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Inelastic Low Energy Electron Diffraction Measurements of Hydrogen Adsorbed Si (001) Surfaces: 2×1:H and 1×1: :2H von Maruno, Shigemitsu, Iwasaki, Hiroshi, Horioka, Keiji, Li, Sung-Te, Nakamura, Shogo

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MANUFACTURING METHOD OF THREE-DIMENSIONAL SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SUBSTRATE PRODUCT, SUBSTRATE PRODUCT, AND THREE-DIMENSIONAL SEMICONDUCTOR DEVICE von HORIOKA KEIJI

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Surface Plasmon Dispersions of Ag Adsorbed Si(111) Surfaces Studied by Angle-Resolved Electron Energy Loss Spectroscopy von Horioka, Keiji, Iwasaki, Hiroshi, Maruno, Shigemitsu, Li, Sung Te, Nakamura, Shogo

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Enhancement of Surface Plasmon excitation by Low-Energy Electron due to Surface Resonance on Si (001)–2×1 von Horioka, Keiji, Iwasaki, Hiroshi, Ichimiya, Ayahiko, Maruno, Shigemitsu, Li, Sung Te, Nakamura, Shogo

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Dispersion of Surface-Plasmon at Clean Si(001)-2×1 Surface von Iwasaki, Hiroshi, Maruno, Shigemitsu, Horioka, Keiji, Li, Sung Te, Nakamura, Shogo

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PATTERN FORMING METHOD, MASK SET, AND ALIGNER von HORIOKA KEIJI

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SEMICONDUCTOR-MANUFACTURING APPARATUS AND ELECTROMAGNETIC COIL-COOLING STRUCTURE THEREOF von HORIOKA KEIJI

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INFORMATION PROVIDING UNIT, SEMICONDUCTOR PRODUCTION SYSTEM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE von HORIOKA KEIJI

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MASK MEMBER, MASK MEMBER SET, SUBSTRATE TREATMENT METHOD, MANUFACTURING METHOD, OF SEMICONDUCTOR DEVICE AND THE METHOD FOR DECIDING MANUFACTURING CONDITIONS OF THE SEMICONDUCTOR DE... von HORIOKA KEIJI

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FREQUENCY DOUBLING USING SPACER MASK von HORIOKA KEIJI, BENCHER CHRISTOPHER D

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DEVICE AND METHOD FOR FEEDING GAS von HORIOKA KEIJI

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