Current tuned slotted Y‐branch laser for wafer thickness measurements with THz radiation von Surkamp, N., Gerling, A., O'Gorman, J., Honsberg, M., Schmidtmann, S., Nandi, U., Preu, S., Sacher, J., Brenner, C., Hofmann, M. R.

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GROND—a 7-Channel Imager von Greiner, J., Bornemann, W., Clemens, C., Deuter, M., Hasinger, G., Honsberg, M., Huber, H., Huber, S., Krauss, M., Krühler, T., Küpcü Yoldaş, A., Mayer-Hasselwander, H., Mican, B., Primak, N., Schrey, F., Steiner, I., Szokoly, G., Thöne, C. C., Yoldaş, A., Klose, S., Laux, U., Winkler, J.

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Two-dimensional photonic crystals produced by additive nanolithography with electron beam-induced deposition act as filters in the infrared von Koops, H.W.P, Hoinkis, O.E, Honsberg, M.E.W, Schmidt, R, Blum, R, Böttger, G, Kuligk, A, Liguda, C, Eich, M

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Fast bevel cross sectioning of quantum‐well semiconductor layers with high resolution von Honsberg, M.

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Parallel optical interconnection for uncoded data transmission with 1 Gb/s-per-channel capacity, high dynamic range, and low power consumption von Karstensen, H., Hanke, C., Honsberg, M., Kropp, J.-R., Wieland, J., Glaser, M., Weger, P., Popp, J.

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A new intelligent power module with enhanced diagnostics and protection von Motto, E. R., Donlon, J. F., Honsberg, M., Tametani, F.

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Self-aligned packaging of an optical switch array with integrated tapers von ACKLIN, B, BELLERMANN, J, SCHIENLE, M, STOLL, L, HONSBERG, M, MÜLLER, G

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New, improved self-protected Intelligent Power Modules with increased efficiency for 10-100kW applications von Donlon, J F, Motto, E R, Honsberg, M, Radke, T, Nobuya, N, Shiori, U, Rei, Y, Fumitaka, T, Shoichi, O

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Optical clock distribution with a compact free space interconnect system von Zarschizky, H., Gerndt, CH, Honsberg, M., Schneider, H. W., Stemmer, A.

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Self-sustained and synchronized optical pulsations of double-contacted MCRW laser diodes von HONSBERG, M., HARTH, W.

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On-chip reliability investigations on power modules actually working in inverter systems von Frank, T., Honsberg-Riedl, M., Simon, P., Otto, J., Ramminger, S., Soelkner, G., Wolfgang, E.

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Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET’s von Castellazzi, A., Kartal, V., Kraus, R., Seliger, N., Honsberg-Riedl, M., Schmitt-Landsiedel, D.

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3-level IGBT modules with trench gate IGBT and their thermal analysis in UPS, PFC and PV operation modes von Honsberg, M., Radke, T.

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A 6-in-1 IGBT module performance evaluation platform determining the trade-off between dV/dt and turn-on loss of different IGBT / FwDi chip setups von Honsberg, M., Radke, T., Ishii, K., Manotobu, J.

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DC-coupled parallel optical interconnect cable with fiber ribbon von Karstensen, H., Hanke, C., Honsberg, M.

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A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes von Ozkilic, M C, Honsberg, M, Radke, T

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Turn-on loss vs. free-wheel diode recovery dv/dt in IGBT modules von Donlon, J. F., Motto, E. R., Honsberg, M., Radke, T., Matsuoka, T.

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MHz power electronic applications von Czekay, D., Guldner, H., Honsberg-Riedl, M., Schemmel, B.

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Self-aligned packing of an optical switch array with integrated tapers von Acklin, B., Bellermann, J., Schienle, M., Stoll, L., Honsberg, M., Muller, G.

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Parallel optical interconnect modules with multifiber connectors von Karstensen, H., Hanke, C., Honsberg, M., Kropp, J., Wieland, J., Blaser, M., Weger, P., Popp, L.

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