MOCVD of high-k dielectrics, tantalum nitride and copper from directly injected liquid precursors von Senzaki, Yoshihide, Hochberg, Arthur K., Norman, John A. T.

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The dynamics of bubblers as vapor delivery systems von Love, Allen, Middleman, Stanley, Hochberg, Arthur K.

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The origin of nonuniform growth of LPCVD films from silane gas mixtures von YECKEL, A, MIDDLEMAN, S, HOCHBERG, A. K

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Chemical additives for improved copper chemical vapour deposition processing von Norman, John A.T., Roberts, David A., Hochberg, Arthur K., Smith, Paul, Petersen, Gary A., Parmeter, John E., Apblett, Chris A., Omstead, Thomas R.

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Cyclic alkylsilanes as low-pressure chemical vapor deposition silicon dioxide precursors von Laxman, Ravi Kumar, Hochberg, Arthur K., Cheng, Hansong, Roberts, David A.

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Precursors for CVD silicon carbo-nitride films von XIAO MANCHAO, HOCHBERG ARTHUR K

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Silicon nitride from aminosilane using PECVD von HOCHBERG ARTHUR K, CUTHILL KIRK S

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Precursors for depositing silicon containing films von XIAO MANCHAO, HOCHBERG ARTHUR K, CUTHILL KIRK S

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Preparation of metal silicon nitride films via cyclic deposition von THRIDANDAM HAREESH, HOCHBERG ARTHUR K, LEI XINJIAN, CUTHILL KIRK S

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Reactant gas flow structure for a low pressure chemical vapor deposition system von HOCHBERG, ARTHUR K

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Dielectrically isolated semiconductor devices von HOCHBERG, ARTHUR K

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Method for fabricating planar semiconductor devices von HOCHBERG, ARTHUR K

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Low temperature deposition of silicon dioxide using organosilanes von LAXMAN, RAVI K, HOCHBERG, ARTHUR K

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Low temperature deposition of silicon dioxide using organosilanes von LAXMAN, RAVI K, HOCHBERG, ARTHUR K

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Precursors for depositing silicon-containing films and processes thereof von LAGENDIJK ANDRE, DEIS LISA A, HOCHBERG ARTHUR K, DEIS THOMAS A, CUTHILL KIRK S

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DEPOSITION OF SILICON DIOXIDE FILMS AT TEMPERATURES AS LOW AS 100 DEGREE C. BY LPCVD USING ORGANODISILANE SOURCES von HOCHBERG, ARTHUR K, ROBERTS, DAVID A

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Deposition of silicon oxide films using alkylsilane liquid sources von HOCHBERG, ARTHUR K, O'MEARA, DAVID L

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Process for improved quality of CVD copper films von HOCHBERG, ARTHUR K, ROBERTS, DAVID A, NORMAN, JOHN A. T

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CVD of Zr-Sn-Ti-O Thin Films by Direct Injection of Solventless Liquid Precursor Mixtures von Senzaki, Yoshihide

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Plasma-enhanced chemical vapour deposition of fluorinated silicon dioxide films using novel alkylsilanes von Laxman, Ravi K., Hochberg, Arthur K., Roberts, David A., Vrtis, Raymond N., Ovalle, Saul

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