Damage free integration of ultralow-k dielectrics by template replacement approach von Zhang, L., de Marneffe, J.-F., Heylen, N., Murdoch, G., Tokei, Z., Boemmels, J., De Gendt, S., Baklanov, M. R.

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3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability von Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F. M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

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Geometry Effect on Impurity Incorporation and Grain Growth in Narrow Copper Lines von Zhang, W., Brongersma, S. H., Heylen, N., Beyer, G., Vandervorst, W., Maex, K.

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P15-22 Particle-induced systemic autoimmune features in C57BL/6J and NOD/ShiLtJ mice von Lemaire, F., Janssen, L., Marain, N., Heylen, N., Koshy, P., Vanstapel, A., Ronsmans, S., Ghosh, M., Hoet, P.

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Differential pulmonary toxicity and autoantibody formation in genetically distinct mouse strains following combined exposure to silica and diesel exhaust particles von Janssen, L.M.F, Lemaire, F, Marain, N.F, Ronsmans, S, Heylen, N, Vanstapel, A, Vande Velde, G.V, Vanoirbeek, J.A.J, Pollard, K.M, Ghosh, M, Hoet, P.H.M

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Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias von Zhao, P., Witters, L., Jourdain, A., Stucchi, M., Jourdan, N., Maes, J. W., Bana, H., Zhu, C., Chukka, R., Sebaai, F., Vandersmissen, K., Heylen, N., Montero, D., Wang, S., D'have, K., Schleicher, F., Vos, J. De, Beyer, G., Miller, A., Beyne, E.

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Barrier and seed repair performance of thin RuTa films for Cu interconnects von Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.

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Surface properties restoration and passivation of high porosity ultra low- k dielectric ( k ∼ 2.3) after direct-CMP von Sinapi, F., Heylen, N., Travaly, Y., Vereecke, G., Baklanov, M., Kesters, E., Van Hoeymissen, J., Hernandèz, J.L., Beyer, G., Fischer, P.

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In-line Small-Spot X-Ray Fluorescence Assessment of Electroplating and Chemical Mechanical Polishing von Gueneau de Mussy, J.-P., Bottiglieri, G., Heylen, N., Carbonell, L., O’Dell, J., Agnihotri, D. K., Tokar, A., Mazor, I.

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Damage free integration of ultralow-k dielectrics by template replacement approach von Zhang, Liping, De Gendt, Stefan, Baklanov, Mikhail, Heylen, N, de Marneffe, Jean-Francois, Murdoch, G, Tokei, Z, Boemmels, J

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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance von Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

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90nm W\Al2O3\TiW\Cu 1T1R CBRAM cell showing low-power, fast and disturb-free operation von Belmonte, A., Kim, W., Chan, Bt, Heylen, N., Fantini, A., Houssa, M., Jurczak, M., Goux, L.

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Effect of MRC-5 fibroblast conditioned medium on breast cancer cell motility and invasion in vitro von Heylen, N, Baurain, R, Remacle, C, Trouet, A

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A new dummy-free shallow trench isolation concept for mixed-signal applications von BADENES, G, ROOYACKERS, R, AUGENDRE, E, VANDAMME, E, PERELLO, C, HEYLEN, N, GRILLAERT, J, DEFERM, L

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High yield sub-0.1µm2 6T-SRAM cells, featuring high-k/metal-gate finfet devices, double gate patterning, a novel fin etch strategy, full-field EUV lithography and optimized junctio... von Horiguchi, N, Demuynck, S, Ercken, M, Locorotondo, S, Lazzarino, F, Altamirano, E, Huffman, C, Brus, S, Demand, M, Struyf, H, De Backer, J, Hermans, J, Delvaux, C, Vandeweyer, T, Baerts, C, Mannaert, G, Truffert, V, Verluijs, J, Alaerts, W, Dekkers, H, Ong, P, Heylen, N, Kellens, K, Volders, H, Hikavyy, A, Vrancken, C, Rakowski, M, Verhaegen, S, Vandenberghe, G, Beyer, G, Lauwers, A, Absil, P, Hoffman, T, Ronse, K, Biesemans, S

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Full reliability study of advanced metallization options for 30 nm one half pitch interconnects von Croes, K, Demuynck, S, Siew, Y K, Pantouvaki, M, Wilson, C J, Heylen, N, Beyer, G P, Toekei, Z

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Gate isolation technology for compact poly-CMP embedded flash memories von Slotboom, M., Goarin, P., Akil, N., van Duuren, M., Demand, M., Wouters, J.M.D., Beckx, S., Leray, P., Baertsb, C., Baerts, C., Heylen, N., Pollentier, I.

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A low-cost 90nm RF-CMOS platform for record RF circuit performance von Jeamsaksiri, W., Linten, D., Thijs, S., Carchon, G., Ramos, J., Mercha, A., Sun, X., Soussan, P., Dehan, M., Chiarella, T., Venegas, R., Subramanian, V., Scholten, A., Wambacq, P., Velghe, R., Mannaert, G., Heylen, N., Verbeeck, R., Boullart, W., Heyvaert, T., Natarajan, M.I., Groeseneken, G., Debusschere, I., Biesemans, S., Decoutere, S.

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Evaluation of Metallization Options for Advanced Cu Interconnects Application von Jourdan, Nicolas, Carbonell, Laureen, Heylen, Nancy, Swerts, Johan, Armini, S., Caro, A. Maestre, Demuynck, S., Croes, K., Beyer, G., Tökei, Zsolt, Elshocht, S. Van, Vancoille, E.

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Highly scalable effective work function engineering approach for multi-VT modulation of planar and FinFET-based RMG high-k last devices for (Sub-)22nm nodes von Veloso, A., Boccardi, G., Ragnarsson, L.-A, Higuchi, Y., Lee, J. W., Simoen, E., Roussel, Ph J., Cho, M. J., Chew, S. A., Schram, T., Dekkers, H., Van Ammel, A., Witters, T., Brus, S., Dangol, A., Paraschiv, V., Vecchio, E., Shi, X., Sebaai, F., Kellens, K., Heylen, N., Devriendt, K., Richard, O., Bender, H., Chiarella, T., Arimura, H., Thean, A., Horiguchi, N.

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