An analysis of the reliability of a wafer level package (WLP) using a silicone under the bump (SUB) configuration von Gonzalez, M., Vandevelde, B., BuIcke, M.V., Winters, C., Beyne, E., Lee, Y.I., Larson, L., HArkness, B.R., Mohamed, M., Meynen, H., Vanlathem, E.

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Study of low-modulus die attach adhesives and molding compounds on warpage and damage of PBGA von Sung Yi, Daharwal, P.D., Lee, Y.J., Harkness, B.R.

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Effects of low-modulus die attach adhesive on warpage and damage of BGA von Sung Yi, Daharwal, P.D., Lee, Y.J., Harkness, B.R.

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Ultraviolet-curable composition and method for forming cured-product patterns therefrom von B.R. HARKNESS, KAZUMI TAKEUCHI, MAMORU TACHIKAWA

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Introducing a silicone under the bump configuration for stress relief in a wafer level package von Vanden Bulcke, M., Gonzalez, M., Vandevelde, B., Winters, C., Beyne, E., Larson, L., Harkness, B.R., Gardner, G., Mohamed, M., Sudbury-Holtschlag, J., Meynen, H.

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Photopatternable silicone compositions for electronics packaging applications von Shih, F.Y., Harkness, B.R., Gardner, G.B., Alger, J.S., Cummings, M.R., Princing, J.L., Meynen, H., Nguyen, H.A., Flack, W.W.

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Quality of Life differences in Male and Female Patients with Head and Neck Cancer von Page, B.R., Guo, Y., Han, P., Cheng, Z., Harkness, J., Shen, C., Choflet, A., Hu, C., Cecil, E., Schmitt, N.C., Shpitser, I., Kiess, A.P., McNutt, T.R., Quon, H.

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Gender Differences in Radiation Therapy Effects in Male and Female Patients With Head and Neck Cancer von Page, B.R., Han, P., Peng, L.C., Cheng, Z., Harkness, J., Shen, C., Choflet, A., Cecil, E., Hui, X., Schmitt, N.C., Shpitser, I., McNutt, T.R., Quon, H.

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Decoding Dysgeusia: Taste Dysfunction in Head and Neck Cancer Patients Receiving Radiation Therapy von Page, B.R., Cheng, Z., Zhou, X.C., Hu, C., Thompson, A., Muse, M., Harkness, J., Choflet, A., Gui, C., Hui, X., Kiess, A.P., McNutt, T.R., Quon, H.

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