Properties of High-Performance Porous SiOC Low-k Film Fabricated Using Electron-Beam Curing von Yoda, Takashi, Fujita, Keiji, Miyajima, Hideshi, Nakata, Rempei, Miyashita, Naoto, Hayasaka, Nobuo

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Structural Studies of High-Performance Low-k Dielectric Materials Improved by Electron-Beam Curing von Yoda, Takashi, Nakasaki, Yasushi, Hashimoto, Hideki, Fujita, Keiji, Miyajima, Hideshi, Shimada, Miyoko, Nakata, Rempei, Kaji, Naruhiko, Hayasaka, Nobuo

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High-Performance SiOF Film Fabricated Using a Dual-Frequency-Plasma Chemical Vapor Deposition system von Yoda, Takashi, Fujita, Keiji, Miyajima, Hideshi, Nakata, Rempei, Nishiyama, Yukio, Nakasaki, Yasushi, Hayasaka, Nobuo

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Formation of single-crystal Al interconnection by in situ annealing von WADA, J.-I, SUGURO, K, HAYASAKA, N, OKANO, H

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Water absorption properties of fluorine-doped SiO2 films using plasma-enhanced chemical vapor deposition von MIYAJIMA, H, KATSUMATA, R, NAKASAKI, Y, NISHIYAMA, Y, HAYASAKA, N

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Ab initio molecular orbital study of water absorption and hydrolysis of chemical vapor deposited SiOF films I von NAKASAKI, Y, MIYAJIMA, I, KATSUMATA, R, HAYASAKA, N

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Ab initio molecular orbital study of water absorption and hydrolysis of chemical vapor deposited SiOF films II von NAKASAKI, Y, MIYAJIMA, H, KATSUMATA, R, HAYASAKA, N

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Synchrotron radiation-assisted etching of silicon surface von HAYASAKA, N, HIRAYA, A, SHOBATAKE, K

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Ab initio molecular orbital study of suppression of water absorption and hydrolysis (F-removal) of chemical-vapor-deposited SiOF films by nitrogen doping von NAKASAKI, Y, MIYAJIMA, H, KATSUMATA, R, HAYASAKA, N

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Mechanism of corrosion in Al-Si-Cu von HAYASAKA, N, KOGA, Y, SHIMOMURA, K, YOSHIDA, Y, OKANO, H

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In situ transmission electron microscopy observation of single crystallization of filled aluminum interconnection von WADA, J.-I, TOYODA, H, KANEKO, H, HAYASAKA, N, YASUDA, H, MORI, H, OKANO, H

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Radiation damage evaluation in excimer laser beam irradiation and reactive ion etching von SEKINE, M, OKANO, H, YAMABE, K, HAYASAKA, N, HORIIKE, Y

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DEVICE FOR PREPARING WHOLE FISH SERVED AS SASHIMI AND METHOD FOR PREPARING THE SAME von HAYASAKA NOBUO

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SQUID PROCESSED PRODUCT AND METHOD FOR PROCESSING SQUID von HAYASAKA NOBUO

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Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method von Shigetou, A., Itoh, T., Matsuo, M., Hayasaka, N., Okumura, K., Suga, T.

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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE von HAYASAKA NOBUO, NAKASAKI YASUSHI

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Trading method of electronic product, trading system of electronic products and trading program product for electronic product von HAYASAKA, NOBUO, MATSUO, MIE

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Multichip semiconductor device, chip therefor and method of formation thereof von MATSUO MIE, SASAKI KEIICHI, HAYASAKA NOBUO, OKUMURA KATSUYA

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Multichip semiconductor device, chip therefor and method of formation thereof von Hayasaka, Nobuo, Okumura, Katsuya, Sasaki, Keiichi, Matsuo, Mie

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Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining von Ikegami, Hiroshi, Hayasaka, Nobuo

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