Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds von Zulkifli, Muhammad Nubli, Harun, Fuaida, Jalar, Azman

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Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds von Zulkifli, Muhammad Nubli, Jalar, Azman, Harun, Fuaida

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An Improvement of Plasma Cleaning Time towards Leadframe Oxidation Performance von Amri, MS, Rashid, Wan Norhisyam Abd, Harun, Fuaida, Kadmin, A.F, Basar, M.F., Rahman, K.A, A.

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Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques von Amri, Mohd Syahrin, Omar, Ghazali, Mispan, Mohd Syafiq, Harun, Fuaida, Othman, M. N. B., Ngatiman, N. A., Ibrahim, Masrullizam Mat

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Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond von Abdullah, Shahrum, Jalar, Azman, Ismail, Roslina, Harun, Fuaida

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Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond von Abdullah, Shahrum, Jalar, Azman, Ismail, Roslina, Harun, Fuaida

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Effect of wire diameter and hook location on second bond failure modes von Harun, Fuaida, Ismail, Roslina, Jalar, Azman, Abdullah, Shahrum

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Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium-Gold-Silver Metallization von Ismail, Roslina, Harun, Fuaida, Zulkifli, Muhammad Nubli, Jalar, Azman, Abu Bakar, Maria, Abdullah, Shahrum

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Semiconductor Chipping Improvement via a Full Sandwich Wafer Mounting Technique von Amri, Mohd Syahrin, Omar, Ghazali, Mispan, Mohd Syafiq, Harun, Fuaida, Mustafa, Zaleha

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Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process von Amri, Mohd Syahrin, Liew, David, Harun, Fuaida

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Challenges in copper 2nd bond quality on nickel palladium leadframe von Tan Kian Heong, Harun, Fuaida

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WIREBONDING INSULATED WIRE von TIU, KONG BEE, HARUN, FUAIDA

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Solving eventual bonding quality to enhance adhesion for QFN packages von Kumar, S, Sivarao, S, Cheong, M T, Azmeer, M, Fuaida, H

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Wirebonding insulated wire von Harun, Fuaida, Tiu, Kong

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Bonding pad von Tan, Lan, Harun, Fuaida

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Wirebonding method for insulated wire von HARUN FUAIDA,TIU KONG BEE

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WIREBONDING INSULATED WIRE von TIU, KONG BEE, HARUN, FUAIDA

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Wirebonding insulated wire von TIU, KONG BEE, HARUN, FUAIDA

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WIREBONDING INSULATED WIRE von TIU KONG BEE, HARUN FUAIDA

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Influence of wafer probing against initial bonding von Kumar, S, Rao, S, Tan Kim Guan, Harun, F

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