Mechanisms for microstructure evolution in electroplated copper thin films near room temperature von Harper, J. M. E., Cabral, C., Andricacos, P. C., Gignac, L., Noyan, I. C., Rodbell, K. P., Hu, C. K.

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Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity von Barmak, K., Gungor, A., Cabral, C., Harper, J. M. E.

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Copper interconnections and reliability von Hu, C.-K., Harper, J.M.E.

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Picosecond ultrasonics study of the vibrational modes of a nanostructure von Antonelli, G. Andrew, Maris, Humphrey J., Malhotra, Sandra G., Harper, James M. E.

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Francois d’Heurle – scientist, teacher and mentor von Harper, James M.E

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Ion doses for low-energy ion-assist applications von Kaufman, H. R., Harper, J. M. E.

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TANTALUM AS A DIFFUSION BARRIER BETWEEN COPPER AND SILICON - FAILURE MECHANISM AND EFFECT OF NITROGEN ADDITIONS von HOLLOWAY, K, FRYER, PM, CABRAL, C, HARPER, JME, BAILEY, PJ, KELLEHER, KH

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Dissociation of dilute immiscible copper alloy thin films von Barmak, K., Lucadamo, G. A., Cabral, C., Lavoie, C., Harper, J. M. E.

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Effects of alloying elements on cobalt silicide formation von LAVOIE, C, CABRAL, C. JR, D'HEURLE, F. M, JORDAN-SWEET, J. L, HARPER, J. M. E

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Evaluation of thermal stability for CMOS gate metal materials von CABRAL, C. JR, LAVOIE, C, OZCAN, A. S, AMOS, R. S, NARAYANAN, V, GUSEV, E. P, JORDAN-SWEET, J. L, HARPER, J. M. E

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Texture of TiSi2 thin films on Si (001) von Özcan, A. S., Ludwig, K. F., Rebbi, P., Lavoie, C., Cabral, C., Harper, J. M. E.

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THE RELATIONSHIP BETWEEN DEPOSITION CONDITIONS, THE BETA TO ALPHA PHASE-TRANSFORMATION, AND STRESS-RELAXATION IN TANTALUM THIN-FILMS von CLEVENGER, LA, MUTSCHELLER, A, HARPER, JME, CABRAL, C, BARMAK, K

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Resistivity–temperature behavior of dilute Cu(Ir) and Cu(W) alloy films von Barmak, K., Cabral, C., Kellock, A.J., Harper, J.M.E.

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Reduction of the C54–TiSi2 phase transformation temperature using refractory metal ion implantation von Mann, R. W., Miles, G. L., Knotts, T. A., Rakowski, D. W., Clevenger, L. A., Harper, J. M. E., D’Heurle, F. M., Cabral, C.

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Optimization of Ta–Si–N thin films for use as oxidation-resistant diffusion barriers von Cabral, C., Saenger, K. L., Kotecki, D. E., Harper, J. M. E.

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The use of in situ X-ray diffraction, optical scattering and resistance analysis techniques for evaluation of copper diffusion barriers in blanket films and damascene structures von Cabral Jr, C, Lavoie, C, Harper, J.M.E, Jordan-Sweet, J

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Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W von Liu, R. F., Hu, C.-K., Gignac, L., Harper, J. M. E., Lloyd, J., Liu, X.-H., Stamper, A. K.

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Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering von D'Heurle, F.M., Harper, J.M.E.

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Materials Research Society Assesses the Quality of Meetings von Harper, James M.E.

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Low temperature formation of C54–TiSi2 using titanium alloys von Cabral, C., Clevenger, L. A., Harper, J. M. E., d’Heurle, F. M., Roy, R. A., Lavoie, C., Saenger, K. L., Miles, G. L., Mann, R. W., Nakos, J. S.

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