Bioresorbable silicon electronic sensors for the brain von Kang, Seung-Kyun, Murphy, Rory K. J., Hwang, Suk-Won, Lee, Seung Min, Harburg, Daniel V., Krueger, Neil A., Shin, Jiho, Gamble, Paul, Cheng, Huanyu, Yu, Sooyoun, Liu, Zhuangjian, McCall, Jordan G., Stephen, Manu, Ying, Hanze, Kim, Jeonghyun, Park, Gayoung, Webb, R. Chad, Lee, Chi Hwan, Chung, Sangjin, Wie, Dae Seung, Gujar, Amit D., Vemulapalli, Bharat, Kim, Albert H., Lee, Kyung-Mi, Cheng, Jianjun, Huang, Younggang, Lee, Sang Hoon, Braun, Paul V., Ray, Wilson Z., Rogers, John A.

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In‐Plane Deformation Mechanics for Highly Stretchable Electronics von Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei‐Yin, Armonas, Agne, Choi, Ki‐Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, Rogers, John A.

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High-Sensitivity Measurement of Density by Magnetic Levitation von Nemiroski, Alex, Kumar, A. A, Soh, Siowling, Harburg, Daniel V, Yu, Hai-Dong, Whitesides, George M

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Using Magnetic Levitation for Non-Destructive Quality Control of Plastic Parts von Hennek, Jonathan W., Nemiroski, Alex, Subramaniam, Anand Bala, Bwambok, David K., Yang, Dian, Harburg, Daniel V., Tricard, Simon, Ellerbee, Audrey K., Whitesides, George M.

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Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node von Yin, Lan, Bozler, Carl, Harburg, Daniel V., Omenetto, Fiorenzo, Rogers, John A.

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Biological lipid membranes for on-demand, wireless drug delivery from thin, bioresorbable electronic implants von Lee, Chi Hwan, Kim, Hojun, Harburg, Daniel V, Park, Gayoung, Ma, Yinji, Pan, Taisong, Kim, Jae Soon, Lee, Na Yeon, Kim, Bong Hoon, Jang, Kyung-In, Kang, Seung-Kyun, Huang, Yonggang, Kim, Jeongmin, Lee, Kyung-Mi, Leal, Cecilia, Rogers, John A

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Wireless bioresorbable electronic system enables sustained nonpharmacological neuroregenerative therapy von Koo, Jahyun, MacEwan, Matthew R., Kang, Seung-Kyun, Won, Sang Min, Stephen, Manu, Gamble, Paul, Xie, Zhaoqian, Yan, Ying, Chen, Yu-Yu, Shin, Jiho, Birenbaum, Nathan, Chung, Sangjin, Kim, Sung Bong, Khalifeh, Jawad, Harburg, Daniel V., Bean, Kelsey, Paskett, Michael, Kim, Jeonghyun, Zohny, Zohny S., Lee, Seung Min, Zhang, Ruoyao, Luo, Kaijing, Ji, Bowen, Banks, Anthony, Lee, Hyuck Mo, Huang, Younggang, Ray, Wilson Z., Rogers, John A.

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A Technology Overview of the PowerChip Development Program von Araghchini, Mohammad, Jun Chen, Doan-Nguyen, Vicky, Harburg, Daniel V., Donghyun Jin, Jungkwun Kim, Min Soo Kim, Seungbum Lim, Bin Lu, Piedra, Daniel, Jizheng Qiu, Ranson, John, Min Sun, Xuehong Yu, Hongseok Yun, Allen, Mark G., del Alamo, Jesus A., DesGroseilliers, Gary, Herrault, Florian, Lang, Jeffrey H., Levey, Christopher G., Murray, Christopher B., Otten, David, Palacios, Tomas, Perreault, David J., Sullivan, Charles R.

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Microfabricated Racetrack Inductors With Thin-Film Magnetic Cores for On-Chip Power Conversion von Harburg, Daniel V., Hanson, Alex J., Qiu, Jizheng, Reese, Bradley A., Ranson, John D., Otten, David M., Levey, Christopher G., Sullivan, Charles R.

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Implementing the Soil Enrichment Protocol at Scale: Opportunities for an Agricultural Carbon Market von Jackson Hammond, Angelyca A., Motew, Melissa, Brummitt, Charles D., DuBuisson, Max L., Pinjuv, Guy, Harburg, Daniel V., Campbell, Eleanor E., Kumar, Ashok A.

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Fabrication and electrochemical performance of thin-film solid oxide fuel cells with large area nanostructured membranes von Johnson, Alex C., Baclig, Antonio, Harburg, Daniel V., Lai, Bo-Kuai, Ramanathan, Shriram

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Stretchable Electronics: In‐Plane Deformation Mechanics for Highly Stretchable Electronics (Adv. Mater. 8/2017) von Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei‐Yin, Armonas, Agne, Choi, Ki‐Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, Rogers, John A.

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Corrigendum: Implementing the Soil Enrichment Protocol at Scale: Opportunities for an Agricultural Carbon Market von Jackson Hammond, Angelyca A., Motew, Melissa, Brummitt, Charles D., DuBuisson, Max L., Pinjuv, Guy, Harburg, Daniel V., Campbell, Eleanor E., Kumar, Ashok A.

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Integrating Magnetics for On-Chip Power: A Perspective von Sullivan, Charles R., Harburg, Daniel V., Jizheng Qiu, Levey, Christopher G., Di Yao

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Integrating Magnetics for On-Chip Power: A Perspective: SPECIAL ISSUE ON POWER SUPPLY CHIP von SULLIVAN, Charles R, HARBURG, Daniel V, JIZHENG QIU, LEVEY, Christopher G, DI YAO

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In-Plane Deformation Mechanics for Highly Stretchable Electronics von Su, Yewang, Ping, Xuecheng, Yu, Ki Jun, Lee, Jung Woo, Fan, Jonathan A., Wang, Bo, Li, Ming, Li, Rui, Harburg, Daniel V., Huang, YongAn, Yu, Cunjiang, Mao, Shimin, Shim, Jaehoun, Yang, Qinglin, Lee, Pei-Yin, Armonas, Agne, Choi, Ki-Joong, Yang, Yichen, Paik, Ungyu, Chang, Tammy, Dawidczyk, Thomas J., Huang, Yonggang, Wang, Shuodao, Rogers, John A.

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A toroidal power inductor using radial-anisotropy thin-film magnetic material based on a hybrid fabrication process von Jizheng Qiu, Harburg, D. V., Sullivan, C. R.

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A Technology Overview of the PowerChip Development Program: SPECIAL ISSUE ON POWER SUPPLY CHIP von ARAGHCHINI, Mohammad, JUN CHEN, JIZHENG QIU, RANSON, John, MIN SUN, XUEHONG YU, HONGSEOK YUN, ALLEN, Mark G, DEL ALAMO, Jesús A, DESGROSEILLIERS, Gary, HERRAULT, Florian, LANG, Jeffrey H, DOAN-NGUYEN, Vicky, LEVEY, Christopher G, MURRAY, Christopher B, OTTEN, David, PALACIOS, Tomás, PERREAULT, David J, SULLIVAN, Charles R, HARBURG, Daniel V, DONGHYUN JIN, JUNGKWUN KIM, MIN SOO KIM, SEUNGBUM LIM, BIN LU, PIEDRA, Daniel

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ENHANCEMENT OF SOFT ROBOTIC GRIPPERS THROUGH INTEGRATION OF STIFF STRUCTURES von VAUSE, CARL E, LESSING, JOSHUA A, KNOPF, RYAN R, HARBURG, DANIEL V

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ENHANCEMENT OF SOFT ROBOTIC GRIPPERS THROUGH INTEGRATION OF STIFF STRUCTURES von VAUSE, Carl, E, HARBURG, Daniel, V, LESSING, Joshua, A, KNOPF, Ryan, R

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