Brittle Properties of Copper Base Lead Frame at Soldered Joint von HARAMAKI, Takashi, NAKAMURA, Mitsuo, MITA, Mamoru

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Joint Mechanism of Press-Soldered Joints in Copper to Copper von Haramaki, Takashi, Nakamura, Mitsuo

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Characteristics of Press-Soldered Joints by using a Resistance Welder von Haramaki, Takashi, Funamoto, Takao, Shida, Tomohiko

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Resistance Heating Bonding of Copper Wires with Insulation Coating Using Tin Plated von HARAMAKI, Takashi, NAKAMURA, Mitsuo, TERAKADO, Katsuyoshi

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Characteristics of Press-soldered Joints of Copper with Dissimilar Materials von Haramaki, Takashi, Nakamura, Mitsuo

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Characteristics of press-soldered joints of copper with dissimilar materials von Haramaki, Takashi, Nakamura, Mitsuo

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Characteristics of Press-Soldered Copper Joints by Bi-Pb Base Solders Containing Ag and Zn von Haramaki, Takashi, Shiota, Katuhiko, Yasuda, Tomio, Kokura, Satoshi, Shida, Tomohiko

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A Study on Microjoining of Leadframe for LSI Package (No.2). Lead Break Mode and Alloy Growth of Microsoldered Layer at fine Pitch Leadframe Microjoining von Mamoru, Mita, Takashi, Haramaki, Hiroshi, Okada

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Relationship of formation of Cu-Sn-Ag alloyed layer at the interface of Pb base solder and copper and joint properties in press soldering von Haramaki, Takashi, Funamoto, Takao, Kokura, Satoshi, Yasuda, Tomio, Shida, Tomohiko

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Durability Evaluation on Metallic Joints of Copper Wire with Insulating Coat von Haramaki, Takashi, Nakamura, Mitsuo, Terakado, Kazuyoshi

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Metallic Joining Technique of Insulated Copper Coil von Haramaki, Takashi, Nakamura, Mituo, Funamoto, Takao, Shida, Tomohiko

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Durability Evaluation of Press-Soldered Joints von Haramaki, Takashi, Nakamura, Mitsuo, Funamoto, Takao, Shida, Tomohiko

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Joint Mechanism of Press-Soldered Joints in Copper to Copper von Haramaki, T, Nakamura, M

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Join Mechanism of Press-Soldered Joints in Copper to Copper von Haramaki, Takashi, Nakamura, Mitsuo

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Resistance Heating Bonding of Copper Wires with Insulation Coating Using Tin Plated Copper Terminal von HARAMAKI, Takashi, NAKAMURA, Mitsuo, TERAKADO, Katsuyoshi

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Lead Break Mode and Alloy Growth of Microsoldered Layer at fine Pitch Leadframe Microjoining: A Study on Microjoining of Leadframe for LSI Package (No. 2) von Mamoru, Mita, Takashi, Haramaki, Hiroshi, Okada

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Peel Strength of microsoldered layer at leadframe microjoining: A study on microjoining of leadframe for LSI package (No.1) von Mita, Mamoru, Haramaki, Takashi, Okada, Hiroshi

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Multi-core conductive wire and a method of manufacturing the same von Haramaki, Takashi, Sakurai, Izumi, Kojima, Yoshitaka

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Multi-core conductive wire and a method of manufacturing the same von HARAMAKI TAKASHI, SAKURAI IZUMI, KOJIMA YOSHITAKA

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Characteristics of Press-Soldered Joints by Using a Resistance Welder von Haramaki, T, Funamoto, T, Shida, T

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