Simultaneous enhancement of strength and ductility in Al-Zn-Cu casting alloy with trace Mg addition designed by first principle calculation von Zeon Han, Seung, Ryu, Byungki, Jeong, Il-Seok, Hwan Lim, Sung, Choi, Eun-Ae

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Strengthening Effect of Decreased Dislocation Density After Annealing in Pure Aluminum or Copper von Choi, Eun-Ae, Lee, Yun Soo, Lee, Sang Jin, Ahn, Jee Hyuk, Lim, Sung Hwan, Semboshi, Satoshi, Han, Seung Zeon

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Behavior of Fatigue Cracks Generated from a Small Artificial-Defect in Plain Specimen of Copper Processed by Equal Channel Angular Pressing von Goto, Masahiro, Iwamura, Takashi, Yamamoto, Takaei, Han, S.Z., Kitamura, Junichi, Yakushiji, Terutoshi

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Formation process of fatigue slip bands with unique configurations of ultrafine-grained high-purity Cu fabricated by severe plastic deformation von Goto, Masahiro, Yakushiji, Terutoshi, Kim, Sangshik, Yamamoto, Takaei, Han, Seung Zeon

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Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound von Han, Seung Zeon, Lim, Sung Hwan, Kim, Sangshik, Lee, Jehyun, Goto, Masahiro, Kim, Hyung Giun, Han, Byungchan, Kim, Kwang Ho

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Statistical description of the effect of Zr addition on the behavior of microcracks in Cu–6Ni–2Mn–2Sn–2Al Alloy von Goto, Masahiro, Han, Seung-Zeon, Euh, Kwangjun, Kawagoishi, Norio, Kim, Sangshik, Kamil, Kusno

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An unexpected surfactant role of immiscible nitrogen in the structural development of silver nanoparticles: an experimental and numerical investigation von Yun, Jungheum, Chung, Hee-Suk, Lee, Sang-Geul, Bae, Jong-Seong, Hong, Tae Eun, Takahashi, Kazutoshi, Yu, Seung Min, Park, Jucheol, Guo, Qixin, Lee, Gun-Hwan, Han, Seung Zeon, Ikoma, Yoshifumi, Choi, Eun-Ae

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Mechanical Strength and Electrical Conductivity of Cu–In Solid Solution Alloy Wires von Abe, Yasunori, Semboshi, Satoshi, Masahashi, Naoya, Lim, Sung Hwan, Choi, Eun-Ae, Han, Seung Zeon

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Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles von Zeon Han, Seung, Kim, Kwang Ho, Kang, Joonhee, Joh, Hongrae, Kim, Sang Min, Ahn, Jee Hyuk, Lee, Jehyun, Lim, Sung Hwan, Han, Byungchan

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Relationship between shear plane of the final pressing and fatigue crack growth behaviour of round-bar specimens of CU processed by ECAP von Goto, Masahiro, Yamamoto, Takaei, Zeon Han, Seung, Hyuk Ahn, Jee, Kitamura, Junichi, Kamil, Kusno, Yakushiji, Terutoshi, Masuda, Toshiki, Iwamura, Takashi, Kim, Sangshik

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Effect of carbon addition on the passivity of hypoeutectic high chromium cast irons von Lee, Jun-Seob, Lee, Jun-Hyeong, Oh, Jun-Seok, Kang, Sung, Baek, Seung-Hoon, Ahn, Jee Hyuk, Han, Seung Zeon, Lee, Je-Hyun

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Increasing ductility beyond post-uniform deformation through Zn lamellae deformation in Al at room temperature von Han, Seung Zeon, Ryu, Byungki, Jeong, Il-Seok, Lim, Sung Hwan, Choi, Eun-Ae

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Growth behavior of fatigue cracks in ultrafine grained Cu smooth specimens with a small hole von Goto, Masahiro, Morita, Kakeru, Kitamura, Junichi, Yamamoto, Takaei, Baba, Masataka, Han, Seung-zeon, Kim, Sangshik

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Discontinuous precipitation at the deformation band in copper alloy von Han, Seung Zeon, Ahn, Jee Hyuk, You, Young Soo, Lee, Jehyun, Goto, Masahiro, Kim, Kwangho, Kim, Sangshik

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Simultaneous increase in strength and ductility by decreasing interface energy between Zn and Al phases in cast Al-Zn-Cu alloy von Han, Seung Zeon, Choi, Eun-Ae, Park, Hyun Woong, Lim, Sung Hwan, Lee, Jehyun, Ahn, Jee Hyuk, Hwang, Nong-Moon, Kim, Kwangho

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Effects of C addition and thermo-mechanical treatments on microstructures and properties of Cu–Fe–P alloys von Kim, Hyung Giun, Han, Seung Zeon, Euh, Kwangjun, Lim, Sung Hwan

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Optimization of conductivity and strength in Cu-Ni-Si alloys by suppressing discontinuous precipitation von Han, Seung Zeon, Lee, Jehyun, Lim, Sung Hwan, Ahn, Jee Hyuk, Kim, Kwangho, Kim, Sangshik

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Reliable and cost effective design of intermetallic Ni2Si nanowires and direct characterization of its mechanical properties von Han, Seung Zeon, Kang, Joonhee, Kim, Sung-Dae, Choi, Si-Young, Kim, Hyung Giun, Lee, Jehyun, Kim, Kwangho, Lim, Sung Hwan, Han, Byungchan

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Formation of nano-sized grains in Cu and Cu−Fe−P alloys by accumulative roll bonding process von Lim, Cha-Yong, Han, Seung-Zeon, Lee, Seong-Hee

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Grain growth in ultrafine grain sized copper during cyclic deformation von Han, Seung Zeon, Goto, Masahiro, Ahn, Jee-Hyuk, Lim, Sung Hwan, Kim, Sangshik, Lee, Jehyun

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