Chip stack structure having shielding capability and system-in-package module using the same von Kwon, Houng-Kyu, Ha, Jeong-O

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Method for searching for dip angle using tilt-compensated electric compass von JO HAN CHUL,CHOI WON TAE,KIM CHANG HYUN,KANG JIN YONG,KWON OH JO,JEONG HA WOONG

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Method for fabricating a flip chip system in package von Kwon, Heung-Kyu, Kim, Tae-Hun, Ha, Jeong-O

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Rational design of hybrid sensor arrays combined synergistically with machine learning for rapid response to a hazardous gas leak environment in chemical plants von Ku, Wonseok, Lee, Geonhee, Lee, Ju-Yeon, Kim, Do-Hyeong, Park, Ki-Hong, Lim, Jongtae, Cho, Donghwi, Ha, Seung-Chul, Jung, Byung-Gil, Hwang, Heesu, Lee, Wooseop, Shin, Huisu, Jang, Ha Seon, Lee, Jeong-O., Hwang, Jin-Ha

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Integrated application of semantic segmentation-assisted deep learning to quantitative multi-phased microstructural analysis in composite materials: Case study of cathode composite... von Hwang, Heesu, Choi, Sung Min, Oh, Jiwon, Bae, Seung-Muk, Lee, Jong-Ho, Ahn, Jae-Pyeong, Lee, Jeong-O., An, Ki-Seok, Yoon, Young, Hwang, Jin-Ha

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Method for fabricating a flip chip system in package von Kwon, Heung-Kyu, Kim, Tae-Hun, Ha, Jeong-O

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Semiconductor device package von Kwon, Heung-kyu, Kim, Se-nyun, Kim, Tae-hun, Ha, Jeong-o, Byun, Hak-kyoon, Park, Sung-yong

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Tunneling Spectroscopy for Electronic Bands in Multi-Walled Carbon Nanotubes with Van Der Waals Gap von Choi, Dong-Hwan, Lee, Seung Mi, Jeong, Du-Won, Lee, Jeong-O, Ha, Dong Han, Bae, Myung-Ho, Kim, Ju-Jin

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Enzyme-Coated Carbon Nanotubes as Single-Molecule Biosensors von Besteman, Koen, Lee, Jeong-O, Wiertz, Frank G. M, Heering, Hendrik A, Dekker, Cees

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Machine Learning-Assisted Gas-Specific Fingerprint Detection/Classification Strategy Based on Mutually Interactive Features of Semiconductor Gas Sensor Arrays von Oh, Jiwon, Hwang, Heesu, Nam, Yoonmi, Lee, Myeong-Il, Lee, Myeong-Jin, Ku, Wonseok, Song, Hye-Won, Pouri, Safa Siavash, Lee, Jeong-O, An, Ki-Seok, Yoon, Young, Lim, Jongtae, Hwang, Jin-Ha

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Chip stack structure having shielding capability and system-in-package module using the same von KWON HOUNG-KYU, HA JEONG-O

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Van-der-Waals-gap tunneling spectroscopy for single-wall carbon nanotubes von Choi, Dong-Hwan, Jang, Seunghun, Jeong, Du-Won, Lee, Jeong-O, Chang, Hyunju, Ha, Dong-Han, Lee, Seung Mi, Kim, Jongwoo, Suh, Yung Doug, Bae, Myung-Ho, Kim, Ju-Jin

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Multi type air-conditioner and control method thereof von YOON SEOK-HO,SUNG SI-KYONG,HA DO-YONG,CHOI JIN-HA,JEONG HO-JONG

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SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME von KWON HEUNG-KYU, HA JEONG-O

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STACKED SEMICONDUCTOR PACKAGES AND THE METHOD OF MANUFACTURING THE SAME von KWON, HEUNG KYU, HA, JEONG O

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Method for fabricating a flip chip system in package von KIM TAE-HUN, KWON HEUNG-KYU, HA JEONG-O

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METHOD FOR ATTACHING SOLDER BALL USING SOLDER BALL FIXING PLATE von PARK, SUNG YONG, HA, JEONG O

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CHIP STACK STRUCTURE INTERPOSING SHIELD PLATE AND SYSTEM IN PACKAGE COMPRISING THE SAME von KWON, HEUNG KYU, HA, JEONG O

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Chip stack structure having shielding capability and system-in-package module using the same von KWON HOUNG-KYU, HA JEONG-O

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SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME von SEO SUN-KYUNG, HA JEONG-OH, KIM YOUNG-SUN, KIM DO-HYUN, KIM HYOEUN, KIM JU-HYEON

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