Recommended Separation Distances for 1.3 Ammunition and Explosives von Guymon, Clint, Liu, Ming, Covino, Josephine

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MPSA effects on copper electrodeposition investigated by molecular dynamics simulations von Guymon, Clint G., Harb, John N., Rowley, Richard L., Wheeler, Dean R.

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The Role of SPS, MPSA, and Chloride in Additive Systems for Copper Electrodeposition von Tan, Min, Guymon, Clint, Wheeler, Dean R., Harb, John N.

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Effects of solvent model flexibility on aqueous electrolyte behavior between electrodes von Guymon, Clint G., Hunsaker, Matthew L., Harb, John N., Henderson, Douglas, Rowley, Richard L.

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System and method of automatically determining material reaction or sensitivity using images von Guymon Clint

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SYSTEM AND METHOD OF AUTOMATICALLY DETERMINING MATERIAL REACTION OR SENSITIVITY USING IMAGES von GUYMON CLINT

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System and method of determining material reaction or sensitivity using high-speed video frames von GUYMON CLINT

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SYSTEM AND METHOD OF DETERMINING MATERIAL REACTION OR SENSITIVITY USING HIGH-SPEED VIDEO FRAMES von GUYMON CLINT

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MPSA Behavior Near a Copper Surface Through Molecular Simulation and Experiment von Guymon, Clint, Harb, John, Wheeler, Dean

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