Estimate of the Vapor Pressure of Squalane at Approximately 293 K Using a Knudsen Cell Method von Gourdin, William H

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Relaxation of compressive stress in gamma-irradiated Viton™ fluoroelastomer von Gourdin, William H., Jensen, Wayne

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Picosecond laser damage performance assessment of multilayer dielectric gratings in vacuum von Alessi, David A, Carr, C Wren, Hackel, Richard P, Negres, Raluca A, Stanion, Kenneth, Fair, James E, Cross, David A, Nissen, James, Luthi, Ronald, Guss, Gabe, Britten, Jerald A, Gourdin, William H, Haefner, Constantin

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Effect of gamma and neutron irradiation on the mechanical properties of Spectralon™ porous PTFE von Gourdin, William H., Datte, Philip, Jensen, Wayne, Khater, Hesham, Pearson, Mark, Girard, Sylvain, Paillet, Philippe, Alozy, Eric

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Mechanical behavior of diffusion-bonded bicrystals of boron-doped Ni3Al von GOURDIN, W. H, WEINLAND, S. L, CAMPBELL, G. H

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Analysis and assessment of electromagnetic ring expansion as a high-strain-rate test von GOURDIN, W. H

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Mechanical behavior of diffusion-bonded bicrystals of boron-doped Ni 3Al von Gourdin, William H., Weinland, Stuart L., Campbell, Geoffrey H.

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Reply to ‘‘Comment on ‘VISAR analysis in the presence of large intensity changes: Application to the expanding ring’ ’’ [Rev. Sci. Instrum. 6 0, 3832 (1989)] von Gourdin, William H.

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The mechanical behavior of pre-shocked copper at strain rates of 10 −3−10 4s −1 and temperatures of 25–400 °C von Gourdin, William H., Lassila, David H.

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Impurity effects on atomic bonding in Ni3Al von Sun, SN, Kioussis, N, Lim, SP, Gonis, A, Gourdin, WH

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The mechanical behavior of pre-shocked copper at strain rates of 10-3-104s-1 and temperatures of 25-400°C von GOURDIN, W. H, LASSILA, D. H

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Performance of piezoresistive carbon sensors in contact with porous materials von Gourdin, William H., Weinland, Stuart L.

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Dynamic Consolidation of Metal Powders von Gourdin, William H

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Particle deposition in a burner von Gourdin, William H., Andrejco, Matthew J.

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Impurity effects on atomic bonding in Ni 3 Al von Sun, Sheng N., Kioussis, Nicholas, Lim, Say-Peng, Gonis, A., Gourdin, William H.

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