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    Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation

    Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation von Yuan, Song, Guo, Xiaoguang, Huang, Junxin, Gou, Yonjun, Jin, Zhuji, Kang, Renke, Guo, Dongming

    Veröffentlicht in Tribology international

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