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  1. 1
    Growth and Healing of Voids at Grain Boundary during High Temperature Creep

    Growth and Healing of Voids at Grain Boundary during High Temperature Creep von Gostomelskii, V.S.


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  2. 2
    Kinetics of diffusion pores dissolving at intercrystalline boundary under coinfluence of compressive stresses and capillary forces

    Kinetics of diffusion pores dissolving at intercrystalline boundary under coinfluence of compressive stresses and capillary forces von Bokstein, B.S, Gostomelskii, V.S, Ivanov, V.A, Petelin, A.L, Petelin, S.A

    Veröffentlicht in Materials letters

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