Integrated circuit device substrates having packaged inductors thereon von Ghai Ajay Kumar, Patel Viresh Piyush, Gubser Robert A

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Crystal oscillator fabrication methods using dual-deposition of mounting cement and dual-curing techniques von Ghai Ajay Kumar, Patel Viresh Piyush, Gubser Robert A

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Integrated circuit device substrates having packaged crystal resonators thereon von GHAI AJAY KUMAR, GUBSER ROBERT A, PATEL VIRESH PIYUSH

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Packaged integrated circuits having high-Q inductors therein and methods of forming same von GHAI AJAY KUMAR, GUBSER ROBERT A, PATEL VIRESH PIYUSH, ASTROF KENNETH L, SHAH JITESH

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Proximity sensor device von GHAI AJAY KUMAR, PATEL PRADIP DHIRAJLAL, CATE STEVE DETLEV

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IC package structures for high power dissipation and low RDSon von Cate, Steven D, Ghai, Ajay Kumar

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IC package structures for high power dissipation and low RDSon von GHAI AJAY KUMAR, CATE STEVEN D

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Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core von Wilcoxen, Duane T, Bojkov, Christo P, Ghai, Ajay Kumar, Cate, Steve Detlev

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Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core von GHAI AJAY KUMAR, BOJKOV CHRISTO P, WILCOXEN DUANE T, CATE STEVE DETLEV

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Use of 3-D printing technologies in craniomaxillofacial surgery: a review von Ghai, Suhani, Sharma, Yogesh, Jain, Neha, Satpathy, Mrinal, Pillai, Ajay Kumar

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Frontal sinus actinomycosis presenting as osteomyelitis of frontal bone von Wadhera, Raman, Gulati, S.P., Garg, Ajay, Ghai, Anju, Kumar, Sanjay

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Primary adenocarcinoma of the frontal sinus von Wadhera, Raman, Gulati, S.P, Garg, Ajay, Ghai, Anju, Kumar, Sanjay

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Primary adenocarcinoma of the frontal sinus von Wadhera, Raman, Gulati, S P, Garg, Ajay, Ghai, Anju, Kumar, Sanjay

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Comparative Evaluation of Middle Meatus Antrostomy with or Without Partial Middle Turbinectomy von Gulati, S. P., Wadhera, Raman, Kumar, Arvind, Gupta, Anshu, Garg, Ajay, Ghai, Anju

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