Enhancing the creep resistance of a cast AZ91 alloy via minor Sc addition von Allami, A., Geranmayeh, A.R., Mahmudi, R.

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High-temperature shear strength of lead-free Sn―Sb―Ag/Al2O3 composite solder von GERANMAYEH, A. R, MAHMUDI, R, KANGOOIE, M

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Impression creep behavior of lead-free Sn–5Sb solder alloy von Mahmudi, R., Geranmayeh, A.R., Rezaee-Bazzaz, A.

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Enhanced superplasticity in equal-channel angularly pressed Sn–5Sb alloy von Mahmudi, R., Alizadeh, R., Geranmayeh, A.R.

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Impression creep of hypoeutectic Sn–Zn lead-free solder alloys von Mahmudi, R., Geranmayeh, A.R., Noori, H., Shahabi, M.

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Impression creep behavior of a Cu–6Ni–2Mn–2Sn–2Al alloy von Akbari-Fakhrabadi, A., Mahmudi, R., Geranmayeh, A.R., Jamshidijam, M.

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Impression creep behavior of cast Pb–Sb alloys von Mahmudi, R., Geranmayeh, A.R., Rezaee-Bazzaz, A.

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Impression creep of a cast Ag-doped AZ91 magnesium alloy von Allami, A., Geranmayeh, A.R., Mahmudi, R.

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Slow strain rate shear test: A novel localized method for evaluating stress corrosion cracking of biodegradable Mg alloys von Faraji, G., Sabbaghian, M., Geranmayeh, A.R., Mahmudi, R.

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Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag von Geranmayeh, A.R., Nayyeri, G., Mahmudi, R.

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Compressive and impression creep behavior of a cast Mg–Al–Zn–Si alloy von Geranmayeh, A.R., Mahmudi, R.

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Indentation creep of a cast Mg–6Al–1Zn–0.7Si alloy von Geranmayeh, A.R., Mahmudi, R.

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Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition von Mahmudi, R., Pourmajidian, M., Geranmayeh, A.R., Gorgannejad, S., Hashemizadeh, S.

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Impression creep study of a Cu–0.3Cr–0.1Ag alloy von Mahmudi, R., Karsaz, A., Akbari-Fakhrabadi, A., Geranmayeh, A.R.

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Indentation creep study of lead-free Sn–5%Sb solder alloy von Mahmudi, R., Geranmayeh, A.R., Bakherad, M., Allami, M.

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Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions von Geranmayeh, A.R., Mahmudi, R., Khalatbari, F., Kashi, N., Nayyeri, G.

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Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles von Kangooie, M., Mahmudi, R., Geranmayeh, A.R.

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High-temperature shear strength of lead-free Sn–Sb–Ag/Al 2O 3 composite solder von Geranmayeh, A.R., Mahmudi, R., Kangooie, M.

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Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy von Mahmudi, R., Geranmayeh, A.R., Noori, H., Taghaddosi, M.

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Effect of cooling rate on the room-temperature impression von Mahmudi, R., Geranmayeh, A.R., Noori, H., Jahangiri, N., Khanbareh, H.

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