Electrochromic and Colorimetric Properties of Nickel(II) Oxide Thin Films Prepared by Aerosol-Assisted Chemical Vapor Deposition von Sialvi, Muhammad Z, Mortimer, Roger J, Wilcox, Geoffrey D, Teridi, Asri Mat, Varley, Thomas S, Wijayantha, K. G. Upul, Kirk, Caroline A

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Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies von Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Lehto, Tero, Wu, Liang, Wilcox, Geoffrey D., Wang, Jing, Collander, Paul, Hokka, Jussi

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Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies von Soldano, Caterina, Ashworth, Mark A., Wilcox, Geoffrey D., Kutilainen, Terho, Hokka, Jussi, Praks, Jaan, Pudas, Marko

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Observations of the spontaneous growth of Tin whiskers on Tin-manganese alloy electrodeposits von KERNING CHEN, WILCOX, Geoffrey D

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An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated Tin Deposits on Brass von Ashworth, Mark A., Wilcox, Geoffrey D., Higginson, Rebecca L., Heath, Richard J., Liu, Changqing

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Influence of Li Additions on the Microstructure and Corrosion Response of 2XXX Series Aluminium Alloys von Wilcox, Geoffrey D., Carrick, David M., Hogg, Simon C.

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Corrosion of an Advanced Al-Cu-Li Alloy for Aerospace Applications von Hogg, Simon, Wilcox, Geoffrey D., Carrick, David M.

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An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry von Şerban, Viorel Aurel, Melcioiu, Georgiana, Liţă, Marin, Codrean, Cosmin, Wilcox, Geoffrey D., Ashworth, Mark

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Tin-manganese alloy electrodeposits I. electrodeposition and microstructural characterization von Chen, Keming, Wilcox, Geoffrey D

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Electrodeposition and Characterization of Nanocrystalline Ni-NbO x Composite Coatings from Glycol-based Electrolytes for High Temperature Electronics Packaging von Wang, Jing, Wilcox, Geoffrey D., Mortimer, Roger J., Liu, Changqing, Ashworth, Mark A.

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Diffusion Barrier Characteristics of Ni-NbO x Composite Electrodeposits for Liquid In-Sn Solder Interconnects von Wang, Jing, Wilcox, Geoffrey D., Mortimer, Roger J., Liu, Changqing, Ashworth, Mark A.

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Tin–Manganese Alloy Electrodeposits von Chen, Keming, Wilcox, Geoffrey D.

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The Role of Nodules in the Growth of Zn Whiskers from Alkaline Cyanide-Free Zn Electrodeposits von Wu, Liang, Ashworth, Mark A, Wilcox, Geoffrey D

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Electrodeposition and Characterisation of Novel Ni-NbO x Composite Coatings as a Diffusion Barrier for Liquid Solder Interconnects - Part II: Diffusion Barrier Performance von Wang, Jing, Wilcox, Geoffrey D, Mortimer, Roger J, Liu, Changqing, Ashworth, Mark A

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Electrodeposition and Characterisation of Novel Ni-NbOx Composite Coatings as a Diffusion Barrier for Liquid Solder Interconnects - Part II: Diffusion Barrier Performance von Wang, Jing, Wilcox, Geoffrey D, Mortimer, Roger J, Liu, Changqing, Ashworth, Mark A

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Producing a thin coloured film on stainless steels – a review. Part 2: non-electrochemical and laser processes von George Alliott, Rebecca Higginson, Geoffrey Wilcox

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Effect of six-month training program on surgical outcomes: The first 100 patients von Felix, Michael D., Wilcox, Geoffrey

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Investigation of whisker growth from alkaline non-cyanide zinc electrodeposits von Liang Wu, Mark Ashworth, Geoffrey Wilcox

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The effect of different post-electroplating surface modification treatments on tin whisker growth von D. Haspel, Mark Ashworth, Geoffrey Wilcox, Xujin Bao, Roger J. Mortimer

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Investigation of zinc whisker growth from electrodeposits produced using an alkaline non-cyanide electroplating bath von Liang Wu, Mark Ashworth, Geoffrey Wilcox

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