Influence of catalyst layer thickness on the growth of nickel silicide nanowires and its application for Li-ion batteries von LUND, Isaac N, JAE HO LEE, EFSTATHIADIS, Harry, HALDAR, Pradeep, GEER, Robert E

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A comparative study of quantum transport properties of silver and copper nanowires using first principles calculations von Kharche, Neerav, Manjari, Swati R, Zhou, Yu, Geer, Robert E, Nayak, Saroj K

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Novel growth mode of solid–liquid–solid (SLS) silica nanowires von Lee, Jae Ho, Carpenter, Michael A., Geer, Robert E.

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Variation of Radial Elasticity in Multiwalled Carbon Nanotubes von Muthaswami, Lata, Zheng, Yuegui, Vajtai, Robert, Shehkawat, G, Ajayan, Pulickel, Geer, Robert E

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Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits von Backes, Benjamin, McDonough, Colin, Smith, Larry, Wang, Wei, Geer, Robert E.

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Metal nanoparticle/polymer superlattice films: Fabrication and control of layer structure von Schmitt, Johannes, Decher, Gero, Dressick, Walter J., Brandow, Susan L., Geer, Robert E., Shashidhar, R., Calvert, Jeffrey M.

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Bilayer Fibril Formation by Genetically Engineered Polypeptides:  Preparation and Characterization von Topilina, Natalya I, Higashiya, Seiichiro, Rana, Narender, Ermolenkov, Vladimir V, Kossow, Christopher, Carlsen, Autumn, Ngo, Silvana C, Wells, Christopher C, Eisenbraun, Eric T, Dunn, Kathleen A, Lednev, Igor K, Geer, Robert E, Kaloyeros, Alain E, Welch, John T

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Metallization of a Genetically Engineered Polypeptide von Carlsen, Autumn, Higashiya, Seiichiro, Topilina, Natasha I., Dunn, Kathleen A., Geer, Robert E., Eisenbraun, Eric T., Kaloyeros, Alain E., Welch, John T.

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Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach von Choobineh, Leila, Carrol, Robert, Gutierrez, Carlos, Geer, Robert

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Controlling Interfacial Adhesion of Self-Assembled Polypeptide Fibrils for Novel Nanoelectromechanical System (NEMS) Applications von Rana, Narender, Kossow, Christopher, Eisenbraun, Eric T., Geer, Robert E., Kaloyeros, Alain E.

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Electromechanical robustness of monolayer graphene with extreme bending von Briggs, Benjamin D., Nagabhirava, Bhaskar, Rao, Gayathri, Geer, Robert, Gao, Haiyuan, Xu, Yang, Yu, Bin

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Investigation of Apertureless NSOM for Measurement of Stress in Strained Silicon-on-Insulator Test Structures von McDonough, Colin, Atesang, Jacob, Wang, Yunfei, Geer, Robert E

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Collective Cu-Cu Thermocompression Bonding Using Pillars von Carroll, Robert, La Tulipe, Douglas, Coolbaugh, Douglas, Geer, Robert

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Integration of energy storage with diesel generation in remote communities von Trevizan, Rodrigo D., Headley, Alexander J., Geer, Robert, Atcitty, Stanley, Gyuk, Imre

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Surface Potential Measurements of Reconfigurable p-n Junctions in Graphene von Wang, Yunfei, Geer, Robert E.

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Processing and functionalization of conductive substoichiometric TiO 2 catalyst supports for PEM fuel cell applications von Phillips, Richard, O’Toole, Alexander, He, Xiaoli, Hansen, Robin, Geer, Robert, Eisenbraun, Eric

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The Cycling Performance and Surface Passivation Qualities of a Heterogeneous Amorphous NixSiOy/Polycrystalline NiSi2 Core Shell Nanowire Used as a Li-Ion Battery Anode von Lund, Isaac N., Lee, Jae Ho, Efstathiadis, Harry, Haldar, Pradeep, Geer, Robert

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Heavy ion radiation effects on TiN/HfO2/W resistive random access memory von He, Xiaoli, Geer, Robert E.

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