1100 × 1100 port MEMS-based optical crossconnect with 4-dB maximum loss von Kim, J, Nuzman, C.J, Kumar, B, Lieuwen, D.F, Kraus, J.S, Weiss, A, Lichtenwalner, C.P, Papazian, A.R, Frahm, R.E, Basavanhally, N.R, Ramsey, D.A, Aksyuk, V.A, Pardo, F, Simon, M.E, Lifton, V, Chan, H.B, Haueis, M, Gasparyan, A, Shea, H.R, Arney, S, Bolle, C.A, Kolodner, P.R, Ryf, R, Neilson, D.T, Gates, J.V

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40-wavelength add drop filter von Doerr, C.R., Stulz, L.W., Cappuzzo, M., Laskowski, E., Paunescu, A., Gomez, L., Gates, J.V., Shunk, S., White, A.E.

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MEMS thermal imager with optical readout von Jones, C.D.W., Bolle, C.A., Ryf, R., Simon, M.E., Pardo, F., Aksyuk, V.A., Lai, W.Y.-C., Bower, J.E., Miner, J.F., Klemens, F.P., Cirelli, R.A., Sorsch, T.W., Ferry, E.J., Fetter, L.A., Pai, C.-S., Taylor, J.A., Vyas, B., Watson, G.P., Stekas, B., Baker, M.R., Papazian, A.R., Basavanhally, N.R., Mansfield, W.M., Kornblit, A., Keller, R.C., Gates, J.V., Ramirez, A.P.

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256 x 256 port optical cross-connect subsystem von NEILSON, David T, FRAHM, R, AKSYUK, V. A, GATES, J. V, KOLODNER, Paul, BOLLE, C. A, RYF, Roland, KIM, J, PAPAZIAN, A. R, NUZMAN, C. J, GASPARYAN, A, BASAVANHALLY, N. R

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Compact 64 × 64 micromechanical optical cross connect von Kozhevnikov, M, Basavanhally, N.R, Weld, J.D, Low, Y.L, Kolodner, P, Bolle, C.A, Ryf, R, Papazian, A.R, Olkhovets, A, Pardo, F, Kim, J, Neilson, D.T, Aksyuk, V.A, Gates, J.V

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238 x 238 micromechanical optical cross connect von Aksyuk, V.A., Arney, S., Basavanhally, N.R., Bishop, D.J., Bolle, C.A., Chang, C.C., Frahm, R., Gasparyan, A., Gates, J.V., George, R., Giles, C.R., Kim, J., Kolodner, P.R., Lee, T.M., Neilson, D.T., Nijander, C., Nuzman, C.J., Paczkowski, M., Papazian, A.R., Pardo, F., Ramsey, D.A., Ryf, R., Scotti, R.E., Shea, H., Simon, M.E.

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Smart dynamic wavelength equalizer based on an integrated planar optical circuit for use in the 1550-nm region von Schiffer, P.M.J., Doerr, C.R., Stulz, L.W., Cappuzzo, M.A., Laskowski, E.J., Paumescu, A., Gomez, L.T., Gates, J.V.

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Compact 64 x 64 micromechanical optical cross connect von Kozhevnikov, M., Basavanhally, N.R., Weld, J.D., Low, Y.L., Kolodner, P., Bolle, C.A., Ryf, R., Papazian, A.R., Olkhovets, A., Pardo, F., Kim, J., Neilson, D.T., Aksyuk, V.A., Gates, J.V.

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Micromechanical optical crossconnect with 4-F relay imaging optics von Kozhevnikov, M., Ryf, R., Neilson, D.T., Kolodner, P., Bolle, C.A., Papazian, A.R., Jungsang Kim, Gates, J.V.

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Critical current uniformity and stability of Nb/Al-oxide-Nb Josephson junctions von GATES, J. V, WASHINGTON, M. A, GURVITCH, M

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256×256 port optical cross-connect subsystem von Neilson, D.T, Frahm, R, Kolodner, P, Bolle, C.A, Ryf, R, Kim, J, Papazian, A.R, Nuzman, C.J, Gasparyan, A, Basavanhally, N.R, Aksyuk, V.A, Gates, J.V

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1100 x 1100 port MEMS-based optical crossconnect with 4-dB maximum loss von Kim, J., Nuzman, C.J., Kumar, B., Lieuwen, D.F., Kraus, J.S., Weiss, A., Lichtenwalner, C.P., Papazian, A.R., Frahm, R.E., Basavanhally, N.R., Ramsey, D.A., Aksyuk, V.A., Pardo, F., Simon, M.E., Lifton, V., Chan, H.B., Haueis, M., Gasparyan, A., Shea, H.R., Arney, S., Bolle, C.A., Kolodner, P.R., Ryf, R., Neilson, D.T., Gates, J.V.

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238×238 micromechanical optical cross connect von Aksyuk, V.A, Arney, S, Basavanhally, N.R, Bishop, D.J, Bolle, C.A, Chang, C.C, Frahm, R, Gasparyan, A, Gates, J.V, George, R, Giles, C.R, Kim, J, Kolodner, P.R, Lee, T.M, Neilson, D.T, Nijander, C, Nuzman, C.J, Paczkowski, M, Papazian, A.R, Pardo, F, Ramsey, D.A, Ryf, R, Scotti, R.E, Shea, H, Simon, M.E

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Evaluation of III-V semiconductor wafers using nondestructive organic-on-inorganic contact barriers von FORREST, S. R, KAPLAN, M. L, SCHMIDT, P. H, GATES, J. V

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Integrated array of 1xN optical switches for wavelength-independent and WDM applications von Kozhevnikov, M, Kolodner, P, Neilson, D T, Papazian, A R, Frahm, R E, Gates, J V

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Integrated array of 1N optical switches for wavelength-independent and WDM applications von Kozhevnikov, M, Kolodner, P, Neilson, D T, Papazian, A R, Frahm, R E, Gates, J V

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3 ω thermal conductivity measurements of thin film dielectrics on silicon for use in cantilever-based IR imaging von Jones, C. D. W., Pardo, F., Pai, C.-S., Bower, J. E., Miner, J. F., Klemens, F. P., Cirelli, R. A., Ferry, E. J., Taylor, J. A., Baker, M. R., Dennis, B. S., Mansfield, W. M., Kornblit, A., Keller, R. C., Gates, J. V., Ramirez, A. P.

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Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules von Beranek, M.W., Chan, E.Y., Chiu-Chao Chen, Davido, K.W., Hager, H.E., Chi-Shain Hong, Koshinz, D.G., Rassaian, M., Soares, H.P., St. Pierre, R.L., Anthony, P.j., Cappuzzo, M.A., Gates, J.V., Gomez, L.T., Henein, G.E., Shmulovich, J., Occhionero, M.A., Fennessy, K.P.

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Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection applications for the optoelectronic technology consortium (OETC) von Yiu-Man Wong, Muehlner, D.J., Faudskar, C.C., Buchholz, D.B., Fishteyn, M., Brandner, J.L., Parzygnat, W.J., Morgan, R.A., Mullally, T., Leibenguth, R.E., Guth, G.D., Focht, M.W., Glogovsky, K.G., Zilko, J.L., Gates, J.V., Anthony, P.J., Tyrone, B.H., Ireland, T.J., Lewis, D.H., Smith, D.F., Nati, S.F., Lewis, D.K., Rogers, D.L., Aispain, H.A., Gowda, S.M., Walker, S.G., Kwark, Y.H., Bates, R.J.S., Kuchta, D.M., Crow, J.D.

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Photonic packaging using laser/receiver arrays and flexible optical circuits von Grimes, G.J., Markush, J.P.C., Yiu-Man Wong, Anthony, P.J., Holland, B., Priest, E.G., Sherman, C.J., Peck, S.R., Muehlner, D.J., Faudskar, C.C., Nyquist, J.S., Helton, J.S., Lepthian, C.A., Sonnier, G.L., Gates, J.V., Honea, W.K., Bortolini, J.R.

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