Evaluation of die coating materials for chip-on-board technology insertion in spaceborne applications von Le, B.Q., Nhan, E., Maurer, R.H., Lew, A.L., Lander, J.R., Lehtonen, S.J., Garrison Darrin, M.A.

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Microelectromechanical devices for satellite thermal control von Osiander, R., Firebaugh, S.L., Champion, J.L., Farrar, D., Darrin, M.A.G.

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